|By Business Wire
|November 12, 2012 04:00 PM EST
Marking a new era in high-performance computing, Intel Corporation
introduced the Intel® Xeon Phi™ coprocessor, a culmination of years of
the research and collaboration, to bring unprecedented performance for
innovative breakthroughs in manufacturing, life sciences, energy and
other areas. The ability to quickly compute, simulate and make more
informed decisions has propelled the growth of high performance
computing (HPC) and analytics. This has been driven by global business
and research priorities to more accurately predict weather patterns,
create more efficient energy resources, and develop cures for diseases
among many other pressing issues. With the breakthrough performance per
watt and other new attributes of Intel Xeon Phi coprocessor, the
industry will have even greater reliability in generating accurate
answers, help proliferate high-performance computing beyond laboratories
and universities and achieve maximum productivity.
“Intel Xeon Phi coprocessor represents an achievement in Intel
innovation that will help propel us to new heights in research and
discovery, and reaffirms our commitment to Exascale-level computing,”
said Diane Bryant, vice president and general manager of the Datacenter
and Connected Systems Group. “The combination of the Intel Xeon
processor family and the Intel Xeon Phi coprocessor will change the
scope and scale of what highly parallel applications can accomplish, by
delivering unprecedented performance, efficiency and programmability.
With this technology as a new foundation for HPC, solving real-world
challenges from accurately predicting weather patterns 21 days in
advance, to developing new cures for diseases will become increasingly
Based on the Intel® Many Integrated Core (Intel® MIC) architecture,
Intel Xeon Phi coprocessors will complement the existing Intel® Xeon®
processor E5-2600/4600 product families to deliver unprecedented
performance for highly parallel applications. The Intel Xeon processor
E5 family is a high-performance computing workhorse that has powered
numerous Top500 systems to Petascale performance (1 quadrillion floating
point operations per second). Now with Intel Xeon Phi products handling
much of the “highly parallel” processing to help supercomputers produce
answers for a wide range of scientific and technical disciplines such as
genetic research, oil and gas exploration and climate modeling, Intel
believes that this powerful combination will help blaze a path to
Exascale computing, which would mark a thousand-fold increase in
computational capabilities over Petascale.
Saving Time and Resources with World’s Most Popular Programing Model
The Intel Xeon Phi coprocessor takes advantage of familiar programming
languages, parallelism models, techniques and developer tools available
for the Intel® architecture. This helps ensure that software companies
and IT departments are equipped with greater use of parallel code
without retraining developers on proprietary and hardware specific
programming models associated with accelerators. Intel is providing the
software tools to help scientists and engineers optimize their code to
take full advantage of Intel Xeon Phi coprocessors, including Intel
Parallel Studio XE and Intel Cluster Studio XE. Available today, these
tools enable code optimization and, through using the same programming
languages and models shared by Intel Xeon Phi coprocessors and Intel
Xeon processors E5 product family, help applications benefit both from
tens of Intel Xeon Phi coprocessor cores and also from more efficient
use of Intel Xeon processor threads.
Introducing Two New Intel Xeon Phi Product Families
Built with Intel’s most advanced 22-nanometer, 3-D tri-gate transistors,
Intel is introducing two new Intel Xeon Phi coprocessor families that
provide optimal performance and performance-per-watt for highly parallel
The Intel Xeon Phi coprocessor 3100 family will provide great value for
those seeking to run compute-bound workloads such as life science
applications and financial simulations. The Intel Xeon Phi 3100 family
will offer more than 1000 Gigaflops (1 TFlops) double-precision
performance, support for up to 6GB memory at 240GB/sec bandwidth, and a
series of reliability features including memory error correction codes
(ECC). The family will operate within a 300W thermal design point (TDP)
The Intel Xeon Phi coprocessor 5110P provides additional performance at
a lower power envelope. It reaches 1,011 Gigaflops (1.01 TFlops)
double-precision performance, and supports 8GB of GDDR5 memory at a
higher 320 GB/sec memory bandwidth. With 225 watts TDP, the passively
cooled Intel Xeon Phi coprocessor 5110P delivers power efficiency that
is ideal for dense computing environments, and is aimed at
capacity-bound workloads such as digital content creation and energy
research. This processor has been delivered to early customers and
featured in the 40th edition of the Top500 list.
To provide early access to new Intel Xeon Phi coprocessor technology for
customers such as Texas Advanced Computing Center (TACC), Intel has
additionally offered customized products: Intel Xeon Phi coprocessor
SE10X and Intel Xeon Phi coprocessor SE10P. These offer 1073 GFlops
double precision performance at a 300W TDP with rest of the
specification similar to Intel Xeon Phi coprocessor 5110P.
Broad Industry and Customers Adoption for Intel Xeon Phi coprocessor
More than 50 manufacturers are designing solutions based on the Intel
Xeon Phi coprocessors, including Acer, Appro, Asus, Bull, Colfax, Cray,
Dell, Eurotech, Fujitsu, Hitachi, HP, IBM, Inspur, NEC, Quanta, SGI,
Supermicro and Tyan.
Professor Stephen Hawking and the Cosmos Lab at the University of
Cambridge have been given early access to Intel Xeon Phi coprocessor
technology for use in their SGI supercomputer. “I am delighted that our
new COSMOS supercomputer from SGI contains the latest many-core
technology from Intel, the Intel Xeon Phi coprocessors,” said Hawking.
“With our powerful and flexible SGI UV2000, we can continue to focus on
discovery, leading worldwide efforts to advance the understanding of our
Majority of Top500 Supercomputers Chose Intel as the Compute Engine
More than 75 percent (379 systems) of the supercomputers on the 40th
edition of the Top500 list are powered by Intel processors. Of those
systems making their first appearance on the list, Intel-powered systems
account for more than 91 percent. The November edition of the list had
recorded seven systems based on Intel Xeon Phi coprocessors, including
initial deployment of TACC’s “Stampede” system (2.66 PFlops, #7 on the
list); “Discover” system at NASA Center for Climate Simulation (417
TFlops, #52); Intel “Endeavour” system (379 TFlops, #57); “MVS-10P”
supercomputer at the Joint Supercomputer Center of the Russian Academy
of Sciences (375 TFlops, #58) “Maia” system at NASA Ames Research Center
(212 TFlops, #117); “SUSU” system at The South Ural State University
(146 TFlops, #170); and the “Beacon” supercomputer at The National
Institute of Computational Sciences at the University of Tennessee (110
TFlops #253) that is also the most power efficient supercomputer on the
list and delivers 2.44 GFlops per watt. The complete report is available
Pricing and Availability
The Intel Xeon Phi coprocessor 5110P is shipping today with general
availability on Jan. 28 with recommended customer price of $2,649. The
Intel Xeon Phi coprocessor 3100 product family will be available during
the first half of 2013 with recommended customer price below $2,000.
Additional information on availability and ordering Intel Xeon Phi
coprocessor 5110P can be found at www.intel.com/xeonphi
More information on SC’12 announcement including Diane Bryant’s
presentation, additional documents and pictures are available at Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The
company designs and builds the essential technologies that serve as the
foundation for the world’s computing devices. Additional information
about Intel is available at newsroom.intel.com
Intel, Intel Xeon and the Intel logo are trademarks of Intel Corporation
in the United States and other countries.
* Other names and brands
may be claimed as the property of others.
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