Welcome!

IBM Cloud Authors: Elizabeth White, Sematext Blog, Liz McMillan, Pat Romanski, Yeshim Deniz

News Feed Item

Semiconductor Market Updates: Networking Equipment Market Slows in Second Half of 2012, Intel Dominates Mid-End Wafers, 3DIC Material Market to Reach $2B in 2017

FARMINGTON, Conn., Nov. 19, 2012 /PRNewswire-iReach/ -- In the networking IC market, growth continues to be driven by infrastructure markets supporting the growing volume of data and users on the Internet. Meanwhile, according to new research from Yole Developpement, the equipment and materials business will quadruple over the next five years in the 3D TSV, FO WLP, 3D WLP, WLCSP, 2.5D interposers and flip-chip wafer segments.

(Photo: http://photos.prnewswire.com/prnh/20121119/CG16190)

Global Information Inc (GII) highlights new market research from our premium partner publishers that will benefit executives involved in the global market for semiconductor materials and manufacturing.

2012 Networking Market Tracker

The overall networking equipment market has slowed in the second half of 2012 with many customers decelerating and reducing spending on hardware. Most of the large equipment OEMs are predicting that fourth quarter revenues will remain flat sequentially from the third quarter, due to exposure to Europe where service providers have cut spending and increasing competition from lower cost domestic equipment makers in China.

The networking IC market consists of products that are used in network equipment including network switches, routers, modems, adapters, cards, line cards, cable infrastructure, DSLAM, and other central office equipment. This market is driven by continued high growth in the infrastructure markets supporting the growing volume of data and users on the Internet.

Capital expenditures for data centers are expected to be up double digits this year, so next year there could be a slowdown. However, this market continues to advance at a pace not seen in other traditional segments. Some OEM customers that serve this market include Cisco Systems, F5 Networks, Juniper Networks, Hewlett Packard, and Huawei. Cisco has the lions share, but the other network equipment providers are steadily gaining momentum in the market.

An Executive Summary for this report and free sample pages from the full document are available at http://www.giiresearch.com/report/data237351-2012-networking-market-tracker.html

Equipment & Materials for 3DIC & Wafer-Level-Packaging

The global material market is expected to grow from approximately $590 million this year to over $2 billion by 2017 at a compound annual growth rate of 24%. Growth in the global market for 3DIC and wafer-level-packaging will be driven mainly by the expansion of 2,5D interposers and 3D TSV& WLP platforms. However, Yole Developpement forecasts a a slight decrease  in 2012 due to the fact that high-volume production in 3D TSV, FO WLP, and 3D WLP has not yet begun.

This report includes an Excel database with detailed activity of over 375 small, medium and large equipment and material suppliers ranging from front-end, back-end assembly, PCB, LCD, and solar divisions.

An Executive Summary for this report and free sample pages from the full document are available at http://www.giiresearch.com/report/yd194054-equipment-materials-3dic-wafer-level-packaging.html

Wafer Packaging Fabs Database 2012

Stay informed on global wafer-scale packaging activity of 275 middle-end factories with this new database from Yole Developpement.  This unique tool provides a global overview of "who is doing what" in this emerging ecosystem. The database provide details concerning each fab location by fab function, customers, JV, capacities by wafer size, and more.

Major companies cited in the database include: Amkor, Analog Devices, ASE, ASTRI, Avago, Bosch, BEA-LETI, China WLCSP, ChipBond, ChipMOS. EPCOS-TDK, Epson Electronics, Fairchild, Flip Chip international, Flip Chip Millennium, Fraunhofer, Freescale, Fujikura, Fujitsu Integrated Microtechnology, Global

Foundries, IBM, IMEC, Infineon, INTEL, ITRI, JCET, Maxim IC, NANIUM, NEPES, NXP, OptoPAC, PTI, Renesas, Rohm, Samsung, SMIC, SK Hynix, Sony, SPIL, STATS ChipPAC, STMicroelectronics, Teramikros, Texas Instrument, Tezzaron, Toshiba, TriQuint, TSMC, UMC Global, and Xintec.

An Executive Summary for this report and free sample pages from the full document are available at http://www.giiresearch.com/report/yd206538-wafer-packaging-fab-database.html

About Global Information Inc. Global Information (GII) (http://www.giiresearch.com) is an information service company partnering with over 300 research companies around the world. Global Information has been in the business of distributing technical and market research for more than 25 years. Expanded from its original headquarters in Japan, Global Information now has offices in Korea, Taiwan, Singapore, Europe and the United States.

Media Contact:

Jeremy Palaia Global Information, Inc., 1-860-674-8796, Press@gii.co.jp

News distributed by PR Newswire iReach: https://ireach.prnewswire.com

SOURCE Global Information, Inc.

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

@ThingsExpo Stories
In his general session at 18th Cloud Expo, Lee Atchison, Principal Cloud Architect and Advocate at New Relic, discussed cloud as a ‘better data center’ and how it adds new capacity (faster) and improves application availability (redundancy). The cloud is a ‘Dynamic Tool for Dynamic Apps’ and resource allocation is an integral part of your application architecture, so use only the resources you need and allocate /de-allocate resources on the fly.
Fifty billion connected devices and still no winning protocols standards. HTTP, WebSockets, MQTT, and CoAP seem to be leading in the IoT protocol race at the moment but many more protocols are getting introduced on a regular basis. Each protocol has its pros and cons depending on the nature of the communications. Does there really need to be only one protocol to rule them all? Of course not. In his session at @ThingsExpo, Chris Matthieu, co-founder and CTO of Octoblu, walk you through how Oct...
IoT is fundamentally transforming the auto industry, turning the vehicle into a hub for connected services, including safety, infotainment and usage-based insurance. Auto manufacturers – and businesses across all verticals – have built an entire ecosystem around the Connected Car, creating new customer touch points and revenue streams. In his session at @ThingsExpo, Macario Namie, Head of IoT Strategy at Cisco Jasper, will share real-world examples of how IoT transforms the car from a static p...
Web Real-Time Communication APIs have quickly revolutionized what browsers are capable of. In addition to video and audio streams, we can now bi-directionally send arbitrary data over WebRTC's PeerConnection Data Channels. With the advent of Progressive Web Apps and new hardware APIs such as WebBluetooh and WebUSB, we can finally enable users to stitch together the Internet of Things directly from their browsers while communicating privately and securely in a decentralized way.
"My role is working with customers, helping them go through this digital transformation. I spend a lot of time talking to banks, big industries, manufacturers working through how they are integrating and transforming their IT platforms and moving them forward," explained William Morrish, General Manager Product Sales at Interoute, in this SYS-CON.tv interview at 18th Cloud Expo, held June 7-9, 2016, at the Javits Center in New York City, NY.
The Internet of Things can drive efficiency for airlines and airports. In their session at @ThingsExpo, Shyam Varan Nath, Principal Architect with GE, and Sudip Majumder, senior director of development at Oracle, will discuss the technical details of the connected airline baggage and related social media solutions. These IoT applications will enhance travelers' journey experience and drive efficiency for the airlines and the airports. The session will include a working demo and a technical d...
Why do your mobile transformations need to happen today? Mobile is the strategy that enterprise transformation centers on to drive customer engagement. In his general session at @ThingsExpo, Roger Woods, Director, Mobile Product & Strategy – Adobe Marketing Cloud, covered key IoT and mobile trends that are forcing mobile transformation, key components of a solid mobile strategy and explored how brands are effectively driving mobile change throughout the enterprise.
Developing software for the Internet of Things (IoT) comes with its own set of challenges. Security, privacy, and unified standards are a few key issues. In addition, each IoT product is comprised of (at least) three separate application components: the software embedded in the device, the back-end service, and the mobile application for the end user’s controls. Each component is developed by a different team, using different technologies and practices, and deployed to a different stack/target –...
Identity is in everything and customers are looking to their providers to ensure the security of their identities, transactions and data. With the increased reliance on cloud-based services, service providers must build security and trust into their offerings, adding value to customers and improving the user experience. Making identity, security and privacy easy for customers provides a unique advantage over the competition.
SYS-CON Events announced today that Commvault, a global leader in enterprise data protection and information management, has been named “Bronze Sponsor” of SYS-CON's 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. Commvault is a leading provider of data protection and information management solutions, helping companies worldwide activate their data to drive more value and business insight and to transform moder...
SYS-CON Events has announced today that Roger Strukhoff has been named conference chair of Cloud Expo and @ThingsExpo 2016 Silicon Valley. The 19th Cloud Expo and 6th @ThingsExpo will take place on November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. "The Internet of Things brings trillions of dollars of opportunity to developers and enterprise IT, no matter how you measure it," stated Roger Strukhoff. "More importantly, it leverages the power of devices and the Interne...
Personalization has long been the holy grail of marketing. Simply stated, communicate the most relevant offer to the right person and you will increase sales. To achieve this, you must understand the individual. Consequently, digital marketers developed many ways to gather and leverage customer information to deliver targeted experiences. In his session at @ThingsExpo, Lou Casal, Founder and Principal Consultant at Practicala, discussed how the Internet of Things (IoT) has accelerated our abil...
Digital innovation is the next big wave of business transformation based on digital technologies of which IoT and Big Data are key components, For example: Business boundary innovation is a challenge to excavate third-party business value using IoT and BigData, like Nest Business structure innovation may propose re-building business structure from scratch, as Uber does in the taxicab industry The social model innovation is also a big challenge to the new social architecture with the design fr...
If you had a chance to enter on the ground level of the largest e-commerce market in the world – would you? China is the world’s most populated country with the second largest economy and the world’s fastest growing market. It is estimated that by 2018 the Chinese market will be reaching over $30 billion in gaming revenue alone. Admittedly for a foreign company, doing business in China can be challenging. Often changing laws, administrative regulations and the often inscrutable Chinese Interne...
So, you bought into the current machine learning craze and went on to collect millions/billions of records from this promising new data source. Now, what do you do with them? Too often, the abundance of data quickly turns into an abundance of problems. How do you extract that "magic essence" from your data without falling into the common pitfalls? In her session at @ThingsExpo, Natalia Ponomareva, Software Engineer at Google, provided tips on how to be successful in large scale machine learning...
In his session at @ThingsExpo, Kausik Sridharabalan, founder and CTO of Pulzze Systems, Inc., will focus on key challenges in building an Internet of Things solution infrastructure. He will shed light on efficient ways of defining interactions within IoT solutions, leading to cost and time reduction. He will also introduce ways to handle data and how one can develop IoT solutions that are lean, flexible and configurable, thus making IoT infrastructure agile and scalable.
Data is an unusual currency; it is not restricted by the same transactional limitations as money or people. In fact, the more that you leverage your data across multiple business use cases, the more valuable it becomes to the organization. And the same can be said about the organization’s analytics. In his session at 19th Cloud Expo, Bill Schmarzo, CTO for the Big Data Practice at EMC, will introduce a methodology for capturing, enriching and sharing data (and analytics) across the organizati...
SYS-CON Events announced today that Bsquare has been named “Silver Sponsor” of SYS-CON's @ThingsExpo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. For more than two decades, Bsquare has helped its customers extract business value from a broad array of physical assets by making them intelligent, connecting them, and using the data they generate to optimize business processes.
Internet of @ThingsExpo has announced today that Chris Matthieu has been named tech chair of Internet of @ThingsExpo 2016 Silicon Valley. The 6thInternet of @ThingsExpo will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.
In his keynote at 18th Cloud Expo, Andrew Keys, Co-Founder of ConsenSys Enterprise, provided an overview of the evolution of the Internet and the Database and the future of their combination – the Blockchain. Andrew Keys is Co-Founder of ConsenSys Enterprise. He comes to ConsenSys Enterprise with capital markets, technology and entrepreneurial experience. Previously, he worked for UBS investment bank in equities analysis. Later, he was responsible for the creation and distribution of life sett...