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Global Next Generation Memory Market (2012 -2017), By Technology (DRAM, SRAM, Flash Memory, Memristor, Magneto Resistive RAM (MRAM), Phase Change RAM (PCRAM), Ferroelectric RAM), Application & Geography

NEW YORK, Dec. 18, 2012 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:

Global Next Generation Memory Market (2012 -2017), By Technology (DRAM, SRAM, Flash Memory, Memristor, Magneto Resistive RAM (MRAM), Phase Change RAM (PCRAM), Ferroelectric RAM), Application & Geography
http://www.reportlinker.com/p01055060/Global-Next-Generation-Memory-Market-2012--2017-By-Technology-DRAM-SRAM-Flash-Memory-Memristor-Magneto-Resistive-RAM-MRAM-Phase-Change-RAM-PCRAM-Ferroelectric-RAM-Application--Geography.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Electronic_Component_and_Semiconductor

Next generation memories are the emerging non-volatile memory technologies, which are expected to replace existing memories. Not all existing memories will be replaced though. Next generation memories majorly targets the non-volatile memories such as NAND and NOR. High write and read latency, scalability, high endurance etc. makes emerging memories the best replacement for traditional non-volatile memories. Next generation memory technologies covered in this report are MRAM, PCRAM, FeRAM and memristor also called as ReRAM. Out of these memories, only MRAM and FeRAM have reasonable market share and they are quite commercialized in the market. PCRAM has very marginal market and memristor is set to enter the market by the end of 2013.

The major drivers for the next generation memory market are faster switching time, high endurance and power efficient. In addition, the huge application base of traditional memories will also become the driver for this market. Since these memories are not completely established, there are still flaws in processes which causes drawbacks like instability and low write endurance rate in some of the memories. As mentioned, these memories are the replacement for flash memories in near future. The flash market has already tapped the huge market and hence it makes the way for next generation memories.

The major issue for next generation memories is its design cost. Not all the processes are intact yet, hence it increases the cost of the process and design. However, early adoption of these memories will be the game changing strategy for memory market. Most of the next generation memories are also called as 'Universal memory', which performs both the function volatile and non-volatile. So the early adoption of such memories will be the crucial for the companies.

The companies currently involved in next generation memory market are Samsung (South Korea), SK Hynix (South Korea), Micron (U.S.), Elpida (Japan), Toshiba (Japan), Powerchip (Taiwan), Winbond (Taiwan), Fujitsu (Japan), Nanya (Taiwan), Rambus (U.S.), Everspin Technology (U.S.), IDT Incorporated (U.S.), HP (U.S.) etc.

Scope of the report

This research report categorizes the global next generation memory market; based on type, applications, and geography; it also covers the forecasted revenue and future applications of global next generation memory market.

On the basis of type

Global next generation memory market is mainly categorized into traditional memories and next generation memories. Traditional memories covered in this report are DRAM, SRAM and flash (NAND and NOR). Next generation or emerging non-volatile memories covered in this report are MRAM, FeRAM, PCRAM and memristor (ReRAM)

On the basis of application areas

Global next generation memory applications market is categorized into computers and storage electronics, ICT, consumer electronics, automotive electronics, industrial applications and aerospace and defence.

On the basis of geography

Geographical analysis covers North America, Europe, Asia-Pacific, and ROW. Europe covers the major countries like Germany, Italy, U.K., France, etc. Asia-Pacific (APAC) covers China, Japan, Taiwan, India, Australia, etc. ROW covers Middle East and Africa.

TABLE OF CONTENTS

1 INTRODUCTION 19
1.1 KEY TAKE-AWAYS 19
1.2 REPORT DESCRIPTION 20
1.3 MARKETS COVERED 21
1.4 STAKEHOLDERS 22
1.5 RESEARCH METHODOLOGY 23
1.5.1 MARKET SIZE 24
1.5.2 KEY DATA POINTS FROM SECONDARY SOURCES 24
1.5.3 KEY DATA POINTS FROM PRIMARY SOURCES 24
1.5.4 ASSUMPTIONS MADE FOR THIS REPORT 25
1.5.5 LIST OF COMPANIES COVERED DURING THE REPORT 27
2 EXECUTIVE SUMMARY 28
3 MARKET OVERVIEW 30
3.1 MARKET DEFINITION 31
3.2 TYPES OF MEMORY TECHNOLOGIES 32
3.3 COMPARISON OF MEMORY TECHNOLOGIES 34
3.4 MARKET DYNAMICS 38
3.4.1 DRIVERS FOR NEXT GENERATION MEMORIES 38
3.4.1.1 Faster switching time, high endurance and efficient power consumption 39
3.4.1.2 Replacement for traditional memory technologies 40
3.4.1.3 Increasing applications base 41
3.4.2 RESTRAINTS 42
3.4.2.1 Stability in harsh conditions 43
3.4.2.2 Low write endurance rate in some memories 43
3.4.3 OPPORTUNITIES 44
3.4.3.1 Penetration in multiple applications 45
3.4.3.1.1 Industrial applications 45
3.4.3.1.2 Flexible electronics 45
3.4.3.1.3 Neural network 45
3.4.3.2 Replacement to flash memory market 46
3.5 BURNING ISSUE 47
3.5.1 HIGH DESIGN COST 47
3.6 WINNING IMPERATIVE 48
3.6.1 EARLY ADOPTION OF UNIVERSAL MEMORY 48
3.7 VALUE CHAIN ANALYSIS 49
3.8 PORTER'S FIVE FORCE MODEL 51
3.8.1 DEGREE OF COMPETITION 52
3.8.2 BUYERS' POWER 52
3.8.3 SUPPLIERS' POWER 52
3.8.4 THREAT FROM SUBSTITUTES 52
3.8.5 THREAT FROM NEW ENTRANTS 52
4 NEXT GENERATION MEMORY MARKET, BY TECHNOLOGY 53
4.1 INTRODUCTION 54
4.2 MEMORY MARKET CLASSIFICATION 55
4.2.1 TRADITIONAL MEMORY TECHNOLOGIES 55
4.2.1.1 Volatile memory 59
4.2.1.1.1 DRAM 60
4.2.1.1.1.1 SDRAM 64
4.2.1.1.1.2 Mobile DRAM 68
4.2.1.1.2 SRAM 72
4.2.1.2 Non-volatile memory 74
4.2.1.2.1 Flash memory 75
4.2.1.2.1.1 NAND 79
4.2.1.2.1.2 NOR 80
4.2.2 NEXT GENERATION MEMORY TECHNOLOGIES 83
4.2.2.1 Memristor or Resistive RAM (RRAM) 87
4.2.2.2 Magneto resistive RAM (MRAM) 89
4.2.2.2.1 STT-RAM or STT-MRAM 90
4.2.2.3 PCRAM 91
4.2.2.4 Ferroelectric RAM (FeRAM) 93
5 NEXT GENERATION MEMORY MARKET, BY APPLICATION 98
5.1 INTRODUCTION 99
5.2 COMPUTER STORAGE 102
5.3 INFORMATION & COMMUNICATION TECHNOLOGY (ICT) 104
5.4 CONSUMER ELECTRONICS 105
5.5 AUTOMOTIVE ELECTRONICS 108
5.6 INDUSTRIAL APPLICATIONS 110
5.7 AEROSPACE AND DEFENSE 112
6 NEXT GENERATION MEMORY MARKET, BY GEOGRAPHY 114
6.1 INTRODUCTION 115
6.2 NORTH AMERICA 116
6.3 EUROPE 121
6.4 APAC 126
6.5 ROW 132
7 COMPETITIVE LANDSCAPE 138
7.1 MARKET SHARE ANALYSIS 139
7.2 MERGERS & ACQUISITIONS 143
7.3 NEW PRODUCT LAUNCH/DEVELOPMENT 144
7.4 COLLABORATIONS/PARTNERSHIPS/AGREEMENTS 154
8 COMPANY PROFILES 158
8.1 ADESTO 158
8.1.1 OVERVIEW 158
8.1.2 PRODUCTS & SERVICES 158
8.1.3 FINANCIALS 158
8.1.4 STRATEGY 159
8.1.5 DEVELOPMENTS 159
8.2 CYPRESS SEMICONDUCTOR CORPORATION. 160
8.2.1 OVERVIEW 160
8.2.2 PRODUCTS & SERVICES 160
8.2.3 FINANCIALS 161
8.2.4 STRATEGY 163
8.2.5 DEVELOPMENTS 164
8.3 CROCUS TECHNOLOGY 166
8.3.1 OVERVIEW 166
8.3.2 PRODUCTS & SERVICES 166
8.3.3 STRATEGY 166
8.3.4 DEVELOPMENTS 167
8.4 EVERSPIN TECHNOLOGIES, INC. 168
8.4.1 OVERVIEW 168
8.4.2 PRODUCTS AND SERVICES 168
8.4.3 STRATEGY 168
8.4.4 DEVELOPMENTS 169
8.5 FUJITSU 170
8.5.1 OVERVIEW 170
8.5.2 PRODUCTS & SERVICES 170
8.5.3 FINANCIALS 172
8.5.4 STRATEGY 174
8.5.5 DEVELOPMENTS 174
8.6 GSI TECHNOLOGY 176
8.6.1 OVERVIEW 176
8.6.2 PRODUCTS & SERVICES 176
8.6.3 FINANCIALS 177
8.6.4 STRATEGY 177
8.6.5 DEVELOPMENTS 177
8.7 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 179
8.7.1 OVERVIEW 179
8.7.2 PRODUCTS & SERVICES 179
8.7.3 FINANCIALS 181
8.7.4 STRATEGY 182
8.7.5 DEVELOPMENTS 183
8.8 IBM 184
8.8.1 OVERVIEW 184
8.8.2 PRODUCTS & SERVICES 184
8.8.3 FINANCIALS 185
8.8.4 STRATEGY 187
8.8.5 DEVELOPMENTS 187
8.9 INTEGRATED DEVICE TECHNOLOGY, INC. 188
8.9.1 OVERVIEW 188
8.9.2 PRODUCTS & SERVICES 188
8.9.3 FINANCIALS 189
8.9.4 STRATEGY 191
8.9.5 DEVELOPMENTS 191
8.10 INTEGRATED SILICON SOLUTIONS, INC. 193
8.10.1 OVERVIEW 193
8.10.2 PRODUCTS & SERVICES 193
8.10.3 FINANCIALS 194
8.10.4 STRATEGY 194
8.10.5 DEVELOPMENTS 194
8.11 INTEL CORPORATION 197
8.11.1 OVERVIEW 197
8.11.2 PRODUCTS & SERVICES 197
8.11.3 FINANCIALS 198
8.11.4 STRATEGY 199
8.11.5 DEVELOPMENTS 200
8.12 MICRON TECHNOLOGY, INC. 201
8.12.1 OVERVIEW 201
8.12.2 PRODUCTS & SERVICES 202
8.12.3 FINANCIALS 203
8.12.4 STRATEGY 204
8.12.5 DEVELOPMENTS 204
8.13 NANYA TECHNOLOGY CORPORATION 206
8.13.1 OVERVIEW 206
8.13.2 PRODUCTS & SERVICES 206
8.13.3 FINANCIALS 207
8.13.4 STRATEGY 207
8.13.5 DEVELOPMENTS 208
8.14 NVE CORPORATION 209
8.14.1 OVERVIEW 209
8.14.2 PRODUCTS & SERVICES 209
8.14.3 FINANCIALS 210
8.14.4 STRATEGY 211
8.14.5 DEVELOPMENTS 211
8.15 OVONYX, INC. 212
8.15.1 OVERVIEW 212
8.15.2 PRODUCTS & SERVICES 212
8.15.3 FINANCIALS 212
8.15.4 STRATEGY 213
8.15.5 DEVELOPMENTS 213
8.16 PROMOS TECHNOLOGIES INC. 214
8.16.1 OVERVIEW 214
8.16.2 PRODUCTS & SERVICES 214
8.16.3 FINANCIALS 215
8.16.4 STRATEGY 215
8.17 POWERCHIP TECHNOLOGY CORPORATION 216
8.17.1 OVERVIEW 216
8.17.2 PRODUCTS & SERVICES 216
8.17.3 FINANCIALS 217
8.17.4 STRATEGY 217
8.18 RAMBUS INC. 218
8.18.1 OVERVIEW 218
8.18.2 PRODUCTS AND SERVICES 218
8.18.3 FINANCIALS 219
8.18.4 STRATEGY 220
8.18.5 DEVELOPMENTS 220
8.19 RAMTRON INTERNATIONAL CORPORATION 221
8.19.1 OVERVIEW 221
8.19.2 PRODUCTS AND SERVICES 221
8.19.3 FINANCIALS 221
8.19.4 STRATEGY 222
8.19.5 DEVELOPMENTS 222
8.20 SAMSUNG 224
8.20.1 OVERVIEW 224
8.20.2 PRODUCTS & SERVICES 224
8.20.3 FINANCIALS 226
8.20.4 STRATEGY 226
8.20.5 DEVELOPMENTS 227
8.21 SK HYNIX INC. 228
8.21.1 OVERVIEW 228
8.21.2 PRODUCTS & SERVICES 228
8.21.3 FINANCIALS 229
8.21.4 STRATEGY 229
8.21.5 DEVELOPMENTS 230
8.22 SONY CORPORATION 231
8.22.1 OVERVIEW 231
8.22.2 PRODUCTS & SERVICES 231
8.22.3 FINANCIALS 232
8.22.4 STRATEGY 234
8.22.5 DEVELOPMENTS 234
8.23 STMICROELECTRONICS 235
8.23.1 OVERVIEW 235
8.23.2 PRODUCTS & SERVICES 235
8.23.3 FINANCIALS 236
8.23.4 STRATEGY 238
8.23.5 DEVELOPMENTS 239
8.24 TEXAS INSTRUMENTS INCORPORATED 240
8.24.1 OVERVIEW 240
8.24.2 PRODUCTS & SERVICES 240
8.24.3 FINANCIALS 242
8.24.4 STRATEGY 243
8.24.5 DEVELOPMENTS 244
8.25 TOSHIBA CORPORATION 245
8.25.1 OVERVIEW 245
8.25.2 PRODUCTS & SERVICES 245
8.25.3 FINANCIALS 247
8.25.4 STRATEGY 248
8.25.5 DEVELOPMENTS 249

8.26 WINBOND ELECTRONICS CORP. 250
8.26.1 OVERVIEW 250
8.26.2 PRODUCTS & SERVICES 250
8.26.3 FINANCIALS 251
8.26.4 STRATEGY 253
8.26.5 DEVELOPMENTS 253

LIST OF TABLES

TABLE 1 GENERAL ASSUMPTIONS 25
TABLE 2 MARKET ASSUMPTIONS 26
TABLE 3 COMPANIES COVERED IN THE REPORT 27
TABLE 4 MEMORY MARKET REVENUE, BY GEOGRAPHY, 2011 – 2017 ($BILLION) 29
TABLE 5 COMPARISON OF DRAM AND SRAM 34
TABLE 6 PARAMETERS FOR THE COMPARISON 35
TABLE 7 COMPARISON OF MEMORY TECHNOLOGIES 36
TABLE 8 MEMORY PERFORMANCE COMPARISON 37
TABLE 9 MEMORY TECHNOLOGY ATTRIBUTES 39
TABLE 10 WRITE ENDURANCE OF DIFFERENT MEMORY TECHNOLOGIES 43
TABLE 11 GLOBAL MEMORY TECHNOLOGY MARKET REVENUE, BY CATEGORY, 2011 - 2017 ($BILLION) 54
TABLE 12 TRADITIONAL MEMORY TECHNOLOGIES MARKET REVENUE,
BY TYPES, 2011 - 2017 ($BILLION) 56
TABLE 13 TRADITIONAL MEMORY MARKET REVENUE, BY GEOGRAPHY,
2011 - 2017 ($BILLION) 57
TABLE 14 TRADITIONAL MEMORY MARKET REVENUE, BY APPLICATIONS,
2011 - 2017 ($BILLION) 58
TABLE 15 PROS AND CONS OF DRAM AND NAND 59
TABLE 16 TRADITIONAL VOLATILE MEMORY MARKET REVENUE, BY TYPES,
2011 - 2017 ($BILLION) 60
TABLE 17 ADVANTAGES & DISADVANTAGES OF DRAM 61
TABLE 18 DRAM MARKET, BY GEOGRAPHY, 2011 - 2017 ($BILLION) 63
TABLE 19 DRAM MARKET, BY APPLICATIONS, 2011 - 2017 ($BILLION) 64
TABLE 20 GLOBAL DDR2 MARKET, BY GEOGRAPHY, 2012 - 2017 ($BILLION) 66
TABLE 21 COMPARISON OF DDR, DDR2 AND DDR3 67
TABLE 22 GLOBAL MOBILE DRAM MARKET, BY GEOGRAPHY,
2012 - 2017 ($BILLION) 69
TABLE 23 COMPARISON OF LPDDR2 AND LPDDR3 70
TABLE 24 MEMORY TECHNOLOGIES VS OPERATING VOLTAGE 70
TABLE 25 GLOBAL DRAM MARKET REVENUE, BY TYPES, 2011 - 2017 ($BILLION) 71
TABLE 26 SRAM MARKET REVENUE, BY GEOGRAPHY, 2011 - 2017 ($BILLION) 72
TABLE 27 SRAM MARKET REVENUE, BY APPLICATIONS, 2011 - 2017 ($BILLION) 73
TABLE 28 TRADITIONAL NON-VOLATILE MEMORY MARKET REVENUE, BY TYPES, 2011 - 2017 ($BILLION) 74
TABLE 29 FLASH MEMORY MARKET REVENUE, BY GEOGRAPHY,
2011 - 2017 ($BILLION) 77
TABLE 30 FLASH MEMORY MARKET REVENUE, BY APPLICATIONS,
2011 - 2017 ($BILLION) 78
TABLE 31 NAND MEMORY MARKET REVENUE, BY GEOGRAPHY,
2011 - 2017 ($BILLION) 79
TABLE 32 GLOBAL NAND MEMORY MARKET REVENUE, BY APPLICATIONS,
2011 - 2017 ($BILLION) 80
TABLE 33 NOR MEMORY MARKET REVENUE, BY GEOGRAPHY,
2011 - 2017 ($BILLION) 81
TABLE 34 NOR MEMORY MARKET REVENUE, BY APPLICATIONS,
2011 - 2017 ($BILLION) 82
TABLE 35 NEXT GENERATION MEMORY MARKET REVENUE, BY MEMORY TYPES, 2011 - 2017 ($BILLION) 83
TABLE 36 NEXT GENERATION MEMORY MARKET REVENUE, BY GEOGRAPHY,
2011 - 2017 ($BILLION) 85
TABLE 37 NEXT GENERATION MEMORY MARKET REVENUE, BY APPLICATIONS, 2011 - 2017 ($BILLION) 86
TABLE 38 ADVANTAGES AND CONCERNS FOR NEXT GENERATION MEMORIES 87
TABLE 39 GLOBAL MEMRISTOR MARKET, BY GEOGRAPHY,
2012 - 2017 ($BILLION) 89
TABLE 40 GLOBAL MRAM MARKET, BY GEOGRAPHY, 2012 - 2017 ($BILLION) 91
TABLE 41 PROS AND CONS OF PHASE CHANGE MEMORY (PCRAM) 92
TABLE 42 GLOBAL PCRAM MARKET, BY GEOGRAPHY, 2012 - 2017 ($BILLION) 93
TABLE 43 PROS AND CONS OF FEFET MEMORY (FERAM) TECHNOLOGY 95
TABLE 44 GLOBAL FERAM MARKET, BY GEOGRAPHY, 2012 - 2017 ($BILLION) 95
TABLE 45 GLOBAL MEMORY MARKET REVENUE, BY APPLICATIONS,
2011 - 2017 ($BILLION) 100
TABLE 46 COMPUTERS AND STORAGE ELECTRONICS MEMORY MARKET REVENUE, BY GEOGRAPHY, 2011 - 2017 ($BILLION) 103
TABLE 47 ICT MEMORY MARKET REVENUE, BY GEOGRAPHY,
2011 - 2017 ($BILLION) 105
TABLE 48 CONSUMER ELECTRONICS MEMORY MARKET REVENUE,
BY GEOGRAPHY, 2011 - 2017 ($BILLION) 107
TABLE 49 AUTOMOTIVE ELECTRONICS MEMORY MARKET REVENUE,
BY GEOGRAPHY, 2011 - 2017 ($BILLION) 109
TABLE 50 INDUSTRIAL MEMORY MARKET, BY GEOGRAPHY,
2011 - 2017 ($BILLION) 111
TABLE 51 AEROSPACE AND DEFENSE MEMORY MARKET REVENUE,
BY GEOGRAPHY, 2011 - 2017 ($BILLION) 113
TABLE 52 NORTH AMERICA: MEMORY MARKET REVENUE, BY TYPES,
2011 - 2017 ($BILLION) 116
TABLE 53 NORTH AMERICA: TRADITIONAL MEMORY MARKET REVENUE,
BY TYPES, 2011 - 2017 ($BILLION) 117
TABLE 54 NORTH AMERICA: TRADITIONAL MEMORY MARKET REVENUE,
BY APPLICATIONS, 2011 - 2017 ($BILLION) 118
TABLE 55 NORTH AMERICA NEXT GENERATION MEMORY MARKET, BY TYPE,
2012 - 2017 ($BILLION) 119
TABLE 56 NORTH AMERICA: NEXT GENERATION MEMORY MARKET REVENUE,
BY APPLICATIONS, 2011 - 2017 ($BILLION) 120
TABLE 57 EUROPE: MEMORY MARKET REVENUE, BY TYPES,
2011 - 2017 ($BILLION) 121
TABLE 58 EUROPE: TRADITIONAL MEMORY MARKET REVENUE, BY TYPES,
2011 - 2017 ($BILLION) 122
TABLE 59 EUROPE: TRADITIONAL MEMORY MARKET REVENUE, BY APPLICATIONS, 2011 - 2017 ($BILLION) 123
TABLE 60 EUROPE NEXT GENERATION MEMORY MARKET, BY TYPE,
2012 - 2017 ($BILLION) 124
TABLE 61 EUROPE: NEXT GENERATION MEMORY MARKET REVENUE,
BY APPLICATIONS, 2011 - 2017 ($BILLION) 125
TABLE 62 APAC: MEMORY MARKET REVENUE, BY TYPES, 2011 - 2017 ($BILLION) 127
TABLE 63 APAC: TRADITIONAL MEMORY MARKET REVENUE, BY TYPES,
2011 - 2017 ($BILLION) 128
TABLE 64 APAC: TRADITIONAL MEMORY MARKET REVENUE, BY APPLICATIONS, 2011 - 2017 ($BILLION) 129
TABLE 65 APAC NEXT GENERATION MEMORY MARKET, BY TYPE,
2012 - 2017 ($BILLION) 130
TABLE 66 APAC: NEXT GENERATION MEMORY MARKET REVENUE,
BY APPLICATIONS, 2011 - 2017 ($BILLION) 131
TABLE 67 ROW: MEMORY MARKET REVENUE, BY TYPES, 2011 - 2017 ($BILLION) 133
TABLE 68 ROW: TRADITIONAL MEMORY MARKET REVENUE, BY TYPES,
2011 - 2017 ($BILLION) 134
TABLE 69 ROW: TRADITIONAL MEMORY MARKET REVENUE, BY APPLICATIONS, 2011 - 2017 ($BILLION) 135
TABLE 70 ROW NEXT GENERATION MEMORY MARKET, BY TYPE,
2012 - 2017 ($BILLION) 136
TABLE 71 ROW NEXT GENERATION MEMORY MARKET REVENUE,
BY APPLICATIONS, 2011 - 2017 ($BILLION) 137
TABLE 72 TOP PLAYERS IN GLOBAL MEMORY MARKET, 2011 139
TABLE 73 TOP PLAYERS IN DRAM MARKET, 2011 140
TABLE 74 TOP PLAYERS IN MOBILE DRAM MARKET, 2011 141
TABLE 75 TOP PLAYERS IN NAND FLASH MARKET, 2011 142
TABLE 76 MERGERS & ACQUISITIONS, 2010 – 2012 143
TABLE 77 NEW PRODUCT LAUNCH/NEW PRODUCT DEVELOPMENT, 2010 – 2012 144
TABLE 78 COLLABORATIONS/PARTNERSHIPS/AGREEMENTS, 2010 – 2012 154
TABLE 79 CYPRESS SEMICONDUCTOR CORPORATION: BUSINESS SEGMENTS 161
TABLE 80 CYPRESS SEMICONDUCTOR CORPORATION: MARKET REVENUE,
2010 - 2011 ($MILLION) 162
TABLE 81 CYPRESS SEMICONDUCTOR CORPORATION: MARKET REVENUE,
BY PRODUCT SEGMENT, 2010 - 2011 ($MILLION) 162
TABLE 82 CYPRESS SEMICONDUCTOR CORPORATION: MARKET REVENUE,
BY GEOGRAPHY, 2010 - 2011 ($MILLION) 163
TABLE 83 FUJITSU: BUSINESS SEGMENTS 171
TABLE 84 FUJITSU: MARKET REVENUE, 2010 - 2011 ($BILLION) 172
TABLE 85 FUJITSU: MARKET REVENUE, BY PRODUCT SEGMENT,
2010 - 2011 ($BILLION) 173
TABLE 86 FUJITSU: MARKET REVENUE, BY GEOGRAPHY, 2010 - 2011 ($BILLION) 173
TABLE 87 GSI TECHNOLOGY: MARKET REVENUE, 2010 - 2011 ($MILLION) 177
TABLE 88 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.: BUSINESS SEGMENTS 180
TABLE 89 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.: MARKET REVENUE, 2010 - 2011 ($BILLION) 181
TABLE 90 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.: MARKET REVENUE, BY PRODUCT SEGMENTS, 2010 - 2011 ($BILLION) 181
TABLE 91 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.: MARKET REVENUE, BY GEOGRAPHY, 2010 - 2011 ($BILLION) 182
TABLE 92 IBM: BUSINESS SEGMENTS 185
TABLE 93 IBM: MARKET REVENUE, 2010 - 2011 ($BILLION) 185
TABLE 94 TOSHIBA CORPORATION: MARKET REVENUE, BY PRODUCT SEGMENT, 2010 - 2011 ($BILLION) 186
TABLE 95 IBM: MARKET REVENUE, BY GEOGRAPHY, 2010 - 2011 ($BILLION) 186
TABLE 96 INTEGRATED DEVICE TECHNOLOGY, INC.: PRODUCT SEGMENTS 189
TABLE 97 INTEGRATED DEVICE TECHNOLOGY, INC.: MARKET REVENUE,
2010 - 2011 ($MILLION) 190
TABLE 98 INTEGRATED DEVICE TECHNOLOGY, INC.: MARKET REVENUE,
BY PRODUCT SEGMENT, 2010 - 2011 ($MILLION) 190
TABLE 99 INTEGRATED DEVICE TECHNOLOGY, INC.: MARKET REVENUE,
BY GEOGRAPHY, 2010 - 2011 ($MILLION) 191
TABLE 100 ISSI: MARKET REVENUE, 2010 - 2011 ($MILLION) 194
TABLE 101 INTEL CORPORATION: MARKET REVENUE, 2010 - 2011 ($BILLION) 198
TABLE 102 INTEL CORPORATION: MARKET REVENUE, BY PRODUCT SEGMENTS, 2010 - 2011 ($BILLION) 198
TABLE 103 INTEL CORPORATION: MARKET REVENUE, BY GEOGRAPHY,
2010 - 2011 ($BILLION) 199
TABLE 104 MICRON TECHNOLOGY, INC. OFFERS BROAD PRODUCT LINE OF MEMORY PRODUCTS. 202
TABLE 105 MICRON TECHNOLOGY, INC.: MARKET REVENUE,
2010 - 2011 ($BILLION) 203
TABLE 106 MICRON TECHNOLOGY, INC.: MARKET REVENUE, BY GEOGRAPHY,
2010 - 2011 ($BILLION) 203
TABLE 107 NANYA TECHNOLOGY CORP.: MARKET REVENUE,
2010 - 2011 ($BILLION) 207
TABLE 108 NVE CORPORATION: MARKET REVENUE, 2010 - 2011 ($MILLION) 210
TABLE 109 NVE CORPORATION: MARKET REVENUE, BY GEOGRAPHY,
2010 - 2011 ($MILLION) 210
TABLE 110 PROMOS TECHNOLOGIES INC.: MARKET REVENUE,
2010 - 2011 ($MILLION) 215
TABLE 111 POWERCHIP TECHNOLOGY: PRODUCT SEGMENTS AND OFFERINGS 216
TABLE 112 POWERCHIP: OVERALL REVENUE, 2010-2011 ($BILLION) 217
TABLE 113 RAMBUS: PRODUCT SEGMENTS AND OFFERINGS 219
TABLE 114 RAMBUS: OVERALL REVENUE, 2010-2011 ($ MILLION) 219
TABLE 115 RAMTRON: OVERALL REVENUE, 2010-2012 ($ MILLION) 222
TABLE 116 PRODUCT SEGMENTS & OFFERINGS 225
TABLE 117 SAMSUNG: OVERALL REVENUE, 2010-2011 ($BILLION) 226
TABLE 118 SK HYNIX: PRODUCT SEGMENTS & OFFERINGS 228
TABLE 119 SK HYNIX: OVERALL REVENUE, 2010-2011 ($BILLION) 229
TABLE 120 SONY CORPORATION: MARKET REVENUE, 2010 - 2011 ($BILLION) 232
TABLE 121 SONY CORPORATION: MARKET REVENUE, BY PRODUCT SEGMENT,
2010 - 2011 ($BILLION) 232
TABLE 122 SONY CORPORATION: MARKET REVENUE, BY GEOGRAPHY,
2010 - 2011 ($BILLION) 233
TABLE 123 STMICROELECTRONICS: BUSINESS SEGMENTS 236
TABLE 124 STMICROELECTRONICS: MARKET REVENUE, 2010 - 2011 ($BILLION) 237
TABLE 125 STMICROELECTRONICS: MARKET REVENUE, BY PRODUCT SEGMENT, 2010 - 2011 ($BILLION) 237
TABLE 126 STMICROELECTRONICS: MARKET REVENUE, BY GEOGRAPHY,
2010 - 2011 ($BILLION) 238
TABLE 127 TEXAS INSTRUMENTS INCORPORATED: BUSINESS SEGMENTS 241
TABLE 128 TEXAS INSTRUMENTS INCORPORATED: MARKET REVENUE,
2010 - 2011 ($BILLION) 242
TABLE 129 TEXAS INSTRUMENTS INCORPORATED: MARKET REVENUE,
BY PRODUCT SEGMENT, 2010 - 2011 ($BILLION) 242
TABLE 130 TEXAS INSTRUMENTS INCORPORATED: MARKET REVENUE,
BY GEOGRAPHY, 2010 - 2011 ($BILLION) 243
TABLE 131 TOSHIBA CORPORATION: BUSINESS SEGMENTS 246
TABLE 132 TOSHIBA CORPORATION: MARKET REVENUE, 2010 - 2011 ($BILLION) 247
TABLE 133 TOSHIBA CORPORATION: MARKET REVENUE, BY PRODUCT,
2010 - 2011 ($BILLION) 247
TABLE 134 TOSHIBA CORPORATION: MARKET REVENUE, BY GEOGRAPHY,
2010 - 2011 ($BILLION) 248
TABLE 135 WINBOND ELECTRONICS CORP.: BUSINESS SEGMENTS 251
TABLE 136 WINBOND ELECTRONICS CORP.: MARKET REVENUE,
2010 - 2011 ($MILLION) 251
TABLE 137 WINBOND ELECTRONICS CORP.: MARKET REVENUE,
BY PRODUCT SEGMENT, 2010 - 2011 ($MILLION) 252
TABLE 138 WINBOND ELECTRONICS CORP.: MARKET REVENUE, BY GEOGRAPHY, 2010 - 2011 ($MILLION) 252

LIST OF FIGURES

FIGURE 1 RESEARCH METHODOLOGY TO DERIVE THE MARKET SIZE 23
FIGURE 2 NEXT GENERATION MEMORY TECHNOLOGY MARKET SEGMENTATION 32
FIGURE 3 GENERAL MEMORY CLASSIFICATION 33
FIGURE 4 IMPACT ANALYSIS OF DRIVERS 38
FIGURE 5 MEMORY CONSUMPTION, 2008 - 2015 ($MILLION) 41
FIGURE 6 IMPACT ANALYSIS OF RESTRAINTS 42
FIGURE 7 FLASH MEMORY MARKET 47
FIGURE 8 VALUE CHAIN OF MEMORY MARKET 49
FIGURE 9 MEMORY MARKET LIFE CYCLE 50
FIGURE 10 PORTER'S FIVE FORCE MODEL 51
FIGURE 11 MARKET PENTRATION, 2012 & 2017 55
FIGURE 12 AVERAGE SELLING PRICE FORECAST OF DRAM 62
FIGURE 13 ZRAM COMPARED WITH DRAM AND SRAM 96
FIGURE 14 PERCENTAGE SPLIT OF TOTAL MEMORY MARKET,
BY APPLICATIONS, 2012 & 2017 101
FIGURE 15 PERCENTAGE SPLIT OF MEMORY MARKET, BY GEOGRAPHY,
2012 & 2017 115

To order this report:
Electronic_Component_and_Semiconductor Industry:
Global Next Generation Memory Market (2012 -2017), By Technology (DRAM, SRAM, Flash Memory, Memristor, Magneto Resistive RAM (MRAM), Phase Change RAM (PCRAM), Ferroelectric RAM), Application & Geography

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@ThingsExpo Stories
DevOps is often described as a combination of technology and culture. Without both, DevOps isn't complete. However, applying the culture to outdated technology is a recipe for disaster; as response times grow and connections between teams are delayed by technology, the culture will die. A Nutanix Enterprise Cloud has many benefits that provide the needed base for a true DevOps paradigm.
My team embarked on building a data lake for our sales and marketing data to better understand customer journeys. This required building a hybrid data pipeline to connect our cloud CRM with the new Hadoop Data Lake. One challenge is that IT was not in a position to provide support until we proved value and marketing did not have the experience, so we embarked on the journey ourselves within the product marketing team for our line of business within Progress. In his session at @BigDataExpo, Sum...
The taxi industry never saw Uber coming. Startups are a threat to incumbents like never before, and a major enabler for startups is that they are instantly “cloud ready.” If innovation moves at the pace of IT, then your company is in trouble. Why? Because your data center will not keep up with frenetic pace AWS, Microsoft and Google are rolling out new capabilities In his session at 20th Cloud Expo, Don Browning, VP of Cloud Architecture at Turner, will posit that disruption is inevitable for c...
SYS-CON Events announced today that Loom Systems will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Founded in 2015, Loom Systems delivers an advanced AI solution to predict and prevent problems in the digital business. Loom stands alone in the industry as an AI analysis platform requiring no prior math knowledge from operators, leveraging the existing staff to succeed in the digital era. With offices in S...
SYS-CON Events announced today that Telecom Reseller has been named “Media Sponsor” of SYS-CON's 20th International Cloud Expo, which will take place on June 6–8, 2017, at the Javits Center in New York City, NY. Telecom Reseller reports on Unified Communications, UCaaS, BPaaS for enterprise and SMBs. They report extensively on both customer premises based solutions such as IP-PBX as well as cloud based and hosted platforms.
SYS-CON Events announced today that Ocean9will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Ocean9 provides cloud services for Backup, Disaster Recovery (DRaaS) and instant Innovation, and redefines enterprise infrastructure with its cloud native subscription offerings for mission critical SAP workloads.
SYS-CON Events announced today that Cloudistics, an on-premises cloud computing company, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Cloudistics delivers a complete public cloud experience with composable on-premises infrastructures to medium and large enterprises. Its software-defined technology natively converges network, storage, compute, virtualization, and management into a ...
SYS-CON Events announced today that CA Technologies has been named “Platinum Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY, and the 21st International Cloud Expo®, which will take place October 31-November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. CA Technologies helps customers succeed in a future where every business – from apparel to energy – is being rewritten by software. From ...
SYS-CON Events announced today that T-Mobile will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. As America's Un-carrier, T-Mobile US, Inc., is redefining the way consumers and businesses buy wireless services through leading product and service innovation. The Company's advanced nationwide 4G LTE network delivers outstanding wireless experiences to 67.4 million customers who are unwilling to compromise on ...
SYS-CON Events announced today that Addteq will exhibit at SYS-CON's DevOps Summit at Cloud Expo, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Addteq specializes in creating innovative solutions to solve business processes through the use of DevOps automation. Addteq was founded on the firm belief that automation is essential for successful software releases. Addteq's products and services are centered around the fundamental approach of understanding the pr...
Keeping pace with advancements in software delivery processes and tooling is taxing even for the most proficient organizations. Point tools, platforms, open source and the increasing adoption of private and public cloud services requires strong engineering rigor - all in the face of developer demands to use the tools of choice. As Agile has settled in as a mainstream practice, now DevOps has emerged as the next wave to improve software delivery speed and output. To make DevOps work, organization...
SYS-CON Events announced today that SoftLayer, an IBM Company, has been named “Gold Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York, New York. SoftLayer, an IBM Company, provides cloud infrastructure as a service from a growing number of data centers and network points of presence around the world. SoftLayer’s customers range from Web startups to global enterprises.
SYS-CON Events announced today that Infranics will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Since 2000, Infranics has developed SysMaster Suite, which is required for the stable and efficient management of ICT infrastructure. The ICT management solution developed and provided by Infranics continues to add intelligence to the ICT infrastructure through the IMC (Infra Management Cycle) based on mathemat...
"I think that everyone recognizes that for IoT to really realize its full potential and value that it is about creating ecosystems and marketplaces and that no single vendor is able to support what is required," explained Esmeralda Swartz, VP, Marketing Enterprise and Cloud at Ericsson, in this SYS-CON.tv interview at @ThingsExpo, held June 7-9, 2016, at the Javits Center in New York City, NY.
The buzz continues for cloud, data analytics and the Internet of Things (IoT) and their collective impact across all industries. But a new conversation is emerging - how do companies use industry disruption and technology enablers to lead in markets undergoing change, uncertainty and ambiguity? Organizations of all sizes need to evolve and transform, often under massive pressure, as industry lines blur and merge and traditional business models are assaulted and turned upside down. In this new da...
Web Real-Time Communication APIs have quickly revolutionized what browsers are capable of. In addition to video and audio streams, we can now bi-directionally send arbitrary data over WebRTC's PeerConnection Data Channels. With the advent of Progressive Web Apps and new hardware APIs such as WebBluetooh and WebUSB, we can finally enable users to stitch together the Internet of Things directly from their browsers while communicating privately and securely in a decentralized way.
SYS-CON Events announced today that HTBase will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. HTBase (Gartner 2016 Cool Vendor) delivers a Composable IT infrastructure solution architected for agility and increased efficiency. It turns compute, storage, and fabric into fluid pools of resources that are easily composed and re-composed to meet each application’s needs. With HTBase, companies can quickly prov...
SYS-CON Events announced today that Outlyer, a monitoring service for DevOps and operations teams, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Outlyer is a monitoring service for DevOps and Operations teams running Cloud, SaaS, Microservices and IoT deployments. Designed for today's dynamic environments that need beyond cloud-scale monitoring, we make monitoring effortless so you ...
SYS-CON Events announced today that MobiDev, a client-oriented software development company, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place June 6-8, 2017, at the Javits Center in New York City, NY, and the 21st International Cloud Expo®, which will take place October 31-November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. MobiDev is a software company that develops and delivers turn-key mobile apps, websites, web services, and complex softw...
In his General Session at 17th Cloud Expo, Bruce Swann, Senior Product Marketing Manager for Adobe Campaign, explored the key ingredients of cross-channel marketing in a digital world. Learn how the Adobe Marketing Cloud can help marketers embrace opportunities for personalized, relevant and real-time customer engagement across offline (direct mail, point of sale, call center) and digital (email, website, SMS, mobile apps, social networks, connected objects).