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Global Next Generation Memory Market (2012 -2017), By Technology (DRAM, SRAM, Flash Memory, Memristor, Magneto Resistive RAM (MRAM), Phase Change RAM (PCRAM), Ferroelectric RAM), Application & Geography

NEW YORK, Dec. 18, 2012 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:

Global Next Generation Memory Market (2012 -2017), By Technology (DRAM, SRAM, Flash Memory, Memristor, Magneto Resistive RAM (MRAM), Phase Change RAM (PCRAM), Ferroelectric RAM), Application & Geography
http://www.reportlinker.com/p01055060/Global-Next-Generation-Memory-Market-2012--2017-By-Technology-DRAM-SRAM-Flash-Memory-Memristor-Magneto-Resistive-RAM-MRAM-Phase-Change-RAM-PCRAM-Ferroelectric-RAM-Application--Geography.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Electronic_Component_and_Semiconductor

Next generation memories are the emerging non-volatile memory technologies, which are expected to replace existing memories. Not all existing memories will be replaced though. Next generation memories majorly targets the non-volatile memories such as NAND and NOR. High write and read latency, scalability, high endurance etc. makes emerging memories the best replacement for traditional non-volatile memories. Next generation memory technologies covered in this report are MRAM, PCRAM, FeRAM and memristor also called as ReRAM. Out of these memories, only MRAM and FeRAM have reasonable market share and they are quite commercialized in the market. PCRAM has very marginal market and memristor is set to enter the market by the end of 2013.

The major drivers for the next generation memory market are faster switching time, high endurance and power efficient. In addition, the huge application base of traditional memories will also become the driver for this market. Since these memories are not completely established, there are still flaws in processes which causes drawbacks like instability and low write endurance rate in some of the memories. As mentioned, these memories are the replacement for flash memories in near future. The flash market has already tapped the huge market and hence it makes the way for next generation memories.

The major issue for next generation memories is its design cost. Not all the processes are intact yet, hence it increases the cost of the process and design. However, early adoption of these memories will be the game changing strategy for memory market. Most of the next generation memories are also called as 'Universal memory', which performs both the function volatile and non-volatile. So the early adoption of such memories will be the crucial for the companies.

The companies currently involved in next generation memory market are Samsung (South Korea), SK Hynix (South Korea), Micron (U.S.), Elpida (Japan), Toshiba (Japan), Powerchip (Taiwan), Winbond (Taiwan), Fujitsu (Japan), Nanya (Taiwan), Rambus (U.S.), Everspin Technology (U.S.), IDT Incorporated (U.S.), HP (U.S.) etc.

Scope of the report

This research report categorizes the global next generation memory market; based on type, applications, and geography; it also covers the forecasted revenue and future applications of global next generation memory market.

On the basis of type

Global next generation memory market is mainly categorized into traditional memories and next generation memories. Traditional memories covered in this report are DRAM, SRAM and flash (NAND and NOR). Next generation or emerging non-volatile memories covered in this report are MRAM, FeRAM, PCRAM and memristor (ReRAM)

On the basis of application areas

Global next generation memory applications market is categorized into computers and storage electronics, ICT, consumer electronics, automotive electronics, industrial applications and aerospace and defence.

On the basis of geography

Geographical analysis covers North America, Europe, Asia-Pacific, and ROW. Europe covers the major countries like Germany, Italy, U.K., France, etc. Asia-Pacific (APAC) covers China, Japan, Taiwan, India, Australia, etc. ROW covers Middle East and Africa.

TABLE OF CONTENTS

1 INTRODUCTION 19
1.1 KEY TAKE-AWAYS 19
1.2 REPORT DESCRIPTION 20
1.3 MARKETS COVERED 21
1.4 STAKEHOLDERS 22
1.5 RESEARCH METHODOLOGY 23
1.5.1 MARKET SIZE 24
1.5.2 KEY DATA POINTS FROM SECONDARY SOURCES 24
1.5.3 KEY DATA POINTS FROM PRIMARY SOURCES 24
1.5.4 ASSUMPTIONS MADE FOR THIS REPORT 25
1.5.5 LIST OF COMPANIES COVERED DURING THE REPORT 27
2 EXECUTIVE SUMMARY 28
3 MARKET OVERVIEW 30
3.1 MARKET DEFINITION 31
3.2 TYPES OF MEMORY TECHNOLOGIES 32
3.3 COMPARISON OF MEMORY TECHNOLOGIES 34
3.4 MARKET DYNAMICS 38
3.4.1 DRIVERS FOR NEXT GENERATION MEMORIES 38
3.4.1.1 Faster switching time, high endurance and efficient power consumption 39
3.4.1.2 Replacement for traditional memory technologies 40
3.4.1.3 Increasing applications base 41
3.4.2 RESTRAINTS 42
3.4.2.1 Stability in harsh conditions 43
3.4.2.2 Low write endurance rate in some memories 43
3.4.3 OPPORTUNITIES 44
3.4.3.1 Penetration in multiple applications 45
3.4.3.1.1 Industrial applications 45
3.4.3.1.2 Flexible electronics 45
3.4.3.1.3 Neural network 45
3.4.3.2 Replacement to flash memory market 46
3.5 BURNING ISSUE 47
3.5.1 HIGH DESIGN COST 47
3.6 WINNING IMPERATIVE 48
3.6.1 EARLY ADOPTION OF UNIVERSAL MEMORY 48
3.7 VALUE CHAIN ANALYSIS 49
3.8 PORTER'S FIVE FORCE MODEL 51
3.8.1 DEGREE OF COMPETITION 52
3.8.2 BUYERS' POWER 52
3.8.3 SUPPLIERS' POWER 52
3.8.4 THREAT FROM SUBSTITUTES 52
3.8.5 THREAT FROM NEW ENTRANTS 52
4 NEXT GENERATION MEMORY MARKET, BY TECHNOLOGY 53
4.1 INTRODUCTION 54
4.2 MEMORY MARKET CLASSIFICATION 55
4.2.1 TRADITIONAL MEMORY TECHNOLOGIES 55
4.2.1.1 Volatile memory 59
4.2.1.1.1 DRAM 60
4.2.1.1.1.1 SDRAM 64
4.2.1.1.1.2 Mobile DRAM 68
4.2.1.1.2 SRAM 72
4.2.1.2 Non-volatile memory 74
4.2.1.2.1 Flash memory 75
4.2.1.2.1.1 NAND 79
4.2.1.2.1.2 NOR 80
4.2.2 NEXT GENERATION MEMORY TECHNOLOGIES 83
4.2.2.1 Memristor or Resistive RAM (RRAM) 87
4.2.2.2 Magneto resistive RAM (MRAM) 89
4.2.2.2.1 STT-RAM or STT-MRAM 90
4.2.2.3 PCRAM 91
4.2.2.4 Ferroelectric RAM (FeRAM) 93
5 NEXT GENERATION MEMORY MARKET, BY APPLICATION 98
5.1 INTRODUCTION 99
5.2 COMPUTER STORAGE 102
5.3 INFORMATION & COMMUNICATION TECHNOLOGY (ICT) 104
5.4 CONSUMER ELECTRONICS 105
5.5 AUTOMOTIVE ELECTRONICS 108
5.6 INDUSTRIAL APPLICATIONS 110
5.7 AEROSPACE AND DEFENSE 112
6 NEXT GENERATION MEMORY MARKET, BY GEOGRAPHY 114
6.1 INTRODUCTION 115
6.2 NORTH AMERICA 116
6.3 EUROPE 121
6.4 APAC 126
6.5 ROW 132
7 COMPETITIVE LANDSCAPE 138
7.1 MARKET SHARE ANALYSIS 139
7.2 MERGERS & ACQUISITIONS 143
7.3 NEW PRODUCT LAUNCH/DEVELOPMENT 144
7.4 COLLABORATIONS/PARTNERSHIPS/AGREEMENTS 154
8 COMPANY PROFILES 158
8.1 ADESTO 158
8.1.1 OVERVIEW 158
8.1.2 PRODUCTS & SERVICES 158
8.1.3 FINANCIALS 158
8.1.4 STRATEGY 159
8.1.5 DEVELOPMENTS 159
8.2 CYPRESS SEMICONDUCTOR CORPORATION. 160
8.2.1 OVERVIEW 160
8.2.2 PRODUCTS & SERVICES 160
8.2.3 FINANCIALS 161
8.2.4 STRATEGY 163
8.2.5 DEVELOPMENTS 164
8.3 CROCUS TECHNOLOGY 166
8.3.1 OVERVIEW 166
8.3.2 PRODUCTS & SERVICES 166
8.3.3 STRATEGY 166
8.3.4 DEVELOPMENTS 167
8.4 EVERSPIN TECHNOLOGIES, INC. 168
8.4.1 OVERVIEW 168
8.4.2 PRODUCTS AND SERVICES 168
8.4.3 STRATEGY 168
8.4.4 DEVELOPMENTS 169
8.5 FUJITSU 170
8.5.1 OVERVIEW 170
8.5.2 PRODUCTS & SERVICES 170
8.5.3 FINANCIALS 172
8.5.4 STRATEGY 174
8.5.5 DEVELOPMENTS 174
8.6 GSI TECHNOLOGY 176
8.6.1 OVERVIEW 176
8.6.2 PRODUCTS & SERVICES 176
8.6.3 FINANCIALS 177
8.6.4 STRATEGY 177
8.6.5 DEVELOPMENTS 177
8.7 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 179
8.7.1 OVERVIEW 179
8.7.2 PRODUCTS & SERVICES 179
8.7.3 FINANCIALS 181
8.7.4 STRATEGY 182
8.7.5 DEVELOPMENTS 183
8.8 IBM 184
8.8.1 OVERVIEW 184
8.8.2 PRODUCTS & SERVICES 184
8.8.3 FINANCIALS 185
8.8.4 STRATEGY 187
8.8.5 DEVELOPMENTS 187
8.9 INTEGRATED DEVICE TECHNOLOGY, INC. 188
8.9.1 OVERVIEW 188
8.9.2 PRODUCTS & SERVICES 188
8.9.3 FINANCIALS 189
8.9.4 STRATEGY 191
8.9.5 DEVELOPMENTS 191
8.10 INTEGRATED SILICON SOLUTIONS, INC. 193
8.10.1 OVERVIEW 193
8.10.2 PRODUCTS & SERVICES 193
8.10.3 FINANCIALS 194
8.10.4 STRATEGY 194
8.10.5 DEVELOPMENTS 194
8.11 INTEL CORPORATION 197
8.11.1 OVERVIEW 197
8.11.2 PRODUCTS & SERVICES 197
8.11.3 FINANCIALS 198
8.11.4 STRATEGY 199
8.11.5 DEVELOPMENTS 200
8.12 MICRON TECHNOLOGY, INC. 201
8.12.1 OVERVIEW 201
8.12.2 PRODUCTS & SERVICES 202
8.12.3 FINANCIALS 203
8.12.4 STRATEGY 204
8.12.5 DEVELOPMENTS 204
8.13 NANYA TECHNOLOGY CORPORATION 206
8.13.1 OVERVIEW 206
8.13.2 PRODUCTS & SERVICES 206
8.13.3 FINANCIALS 207
8.13.4 STRATEGY 207
8.13.5 DEVELOPMENTS 208
8.14 NVE CORPORATION 209
8.14.1 OVERVIEW 209
8.14.2 PRODUCTS & SERVICES 209
8.14.3 FINANCIALS 210
8.14.4 STRATEGY 211
8.14.5 DEVELOPMENTS 211
8.15 OVONYX, INC. 212
8.15.1 OVERVIEW 212
8.15.2 PRODUCTS & SERVICES 212
8.15.3 FINANCIALS 212
8.15.4 STRATEGY 213
8.15.5 DEVELOPMENTS 213
8.16 PROMOS TECHNOLOGIES INC. 214
8.16.1 OVERVIEW 214
8.16.2 PRODUCTS & SERVICES 214
8.16.3 FINANCIALS 215
8.16.4 STRATEGY 215
8.17 POWERCHIP TECHNOLOGY CORPORATION 216
8.17.1 OVERVIEW 216
8.17.2 PRODUCTS & SERVICES 216
8.17.3 FINANCIALS 217
8.17.4 STRATEGY 217
8.18 RAMBUS INC. 218
8.18.1 OVERVIEW 218
8.18.2 PRODUCTS AND SERVICES 218
8.18.3 FINANCIALS 219
8.18.4 STRATEGY 220
8.18.5 DEVELOPMENTS 220
8.19 RAMTRON INTERNATIONAL CORPORATION 221
8.19.1 OVERVIEW 221
8.19.2 PRODUCTS AND SERVICES 221
8.19.3 FINANCIALS 221
8.19.4 STRATEGY 222
8.19.5 DEVELOPMENTS 222
8.20 SAMSUNG 224
8.20.1 OVERVIEW 224
8.20.2 PRODUCTS & SERVICES 224
8.20.3 FINANCIALS 226
8.20.4 STRATEGY 226
8.20.5 DEVELOPMENTS 227
8.21 SK HYNIX INC. 228
8.21.1 OVERVIEW 228
8.21.2 PRODUCTS & SERVICES 228
8.21.3 FINANCIALS 229
8.21.4 STRATEGY 229
8.21.5 DEVELOPMENTS 230
8.22 SONY CORPORATION 231
8.22.1 OVERVIEW 231
8.22.2 PRODUCTS & SERVICES 231
8.22.3 FINANCIALS 232
8.22.4 STRATEGY 234
8.22.5 DEVELOPMENTS 234
8.23 STMICROELECTRONICS 235
8.23.1 OVERVIEW 235
8.23.2 PRODUCTS & SERVICES 235
8.23.3 FINANCIALS 236
8.23.4 STRATEGY 238
8.23.5 DEVELOPMENTS 239
8.24 TEXAS INSTRUMENTS INCORPORATED 240
8.24.1 OVERVIEW 240
8.24.2 PRODUCTS & SERVICES 240
8.24.3 FINANCIALS 242
8.24.4 STRATEGY 243
8.24.5 DEVELOPMENTS 244
8.25 TOSHIBA CORPORATION 245
8.25.1 OVERVIEW 245
8.25.2 PRODUCTS & SERVICES 245
8.25.3 FINANCIALS 247
8.25.4 STRATEGY 248
8.25.5 DEVELOPMENTS 249

8.26 WINBOND ELECTRONICS CORP. 250
8.26.1 OVERVIEW 250
8.26.2 PRODUCTS & SERVICES 250
8.26.3 FINANCIALS 251
8.26.4 STRATEGY 253
8.26.5 DEVELOPMENTS 253

LIST OF TABLES

TABLE 1 GENERAL ASSUMPTIONS 25
TABLE 2 MARKET ASSUMPTIONS 26
TABLE 3 COMPANIES COVERED IN THE REPORT 27
TABLE 4 MEMORY MARKET REVENUE, BY GEOGRAPHY, 2011 – 2017 ($BILLION) 29
TABLE 5 COMPARISON OF DRAM AND SRAM 34
TABLE 6 PARAMETERS FOR THE COMPARISON 35
TABLE 7 COMPARISON OF MEMORY TECHNOLOGIES 36
TABLE 8 MEMORY PERFORMANCE COMPARISON 37
TABLE 9 MEMORY TECHNOLOGY ATTRIBUTES 39
TABLE 10 WRITE ENDURANCE OF DIFFERENT MEMORY TECHNOLOGIES 43
TABLE 11 GLOBAL MEMORY TECHNOLOGY MARKET REVENUE, BY CATEGORY, 2011 - 2017 ($BILLION) 54
TABLE 12 TRADITIONAL MEMORY TECHNOLOGIES MARKET REVENUE,
BY TYPES, 2011 - 2017 ($BILLION) 56
TABLE 13 TRADITIONAL MEMORY MARKET REVENUE, BY GEOGRAPHY,
2011 - 2017 ($BILLION) 57
TABLE 14 TRADITIONAL MEMORY MARKET REVENUE, BY APPLICATIONS,
2011 - 2017 ($BILLION) 58
TABLE 15 PROS AND CONS OF DRAM AND NAND 59
TABLE 16 TRADITIONAL VOLATILE MEMORY MARKET REVENUE, BY TYPES,
2011 - 2017 ($BILLION) 60
TABLE 17 ADVANTAGES & DISADVANTAGES OF DRAM 61
TABLE 18 DRAM MARKET, BY GEOGRAPHY, 2011 - 2017 ($BILLION) 63
TABLE 19 DRAM MARKET, BY APPLICATIONS, 2011 - 2017 ($BILLION) 64
TABLE 20 GLOBAL DDR2 MARKET, BY GEOGRAPHY, 2012 - 2017 ($BILLION) 66
TABLE 21 COMPARISON OF DDR, DDR2 AND DDR3 67
TABLE 22 GLOBAL MOBILE DRAM MARKET, BY GEOGRAPHY,
2012 - 2017 ($BILLION) 69
TABLE 23 COMPARISON OF LPDDR2 AND LPDDR3 70
TABLE 24 MEMORY TECHNOLOGIES VS OPERATING VOLTAGE 70
TABLE 25 GLOBAL DRAM MARKET REVENUE, BY TYPES, 2011 - 2017 ($BILLION) 71
TABLE 26 SRAM MARKET REVENUE, BY GEOGRAPHY, 2011 - 2017 ($BILLION) 72
TABLE 27 SRAM MARKET REVENUE, BY APPLICATIONS, 2011 - 2017 ($BILLION) 73
TABLE 28 TRADITIONAL NON-VOLATILE MEMORY MARKET REVENUE, BY TYPES, 2011 - 2017 ($BILLION) 74
TABLE 29 FLASH MEMORY MARKET REVENUE, BY GEOGRAPHY,
2011 - 2017 ($BILLION) 77
TABLE 30 FLASH MEMORY MARKET REVENUE, BY APPLICATIONS,
2011 - 2017 ($BILLION) 78
TABLE 31 NAND MEMORY MARKET REVENUE, BY GEOGRAPHY,
2011 - 2017 ($BILLION) 79
TABLE 32 GLOBAL NAND MEMORY MARKET REVENUE, BY APPLICATIONS,
2011 - 2017 ($BILLION) 80
TABLE 33 NOR MEMORY MARKET REVENUE, BY GEOGRAPHY,
2011 - 2017 ($BILLION) 81
TABLE 34 NOR MEMORY MARKET REVENUE, BY APPLICATIONS,
2011 - 2017 ($BILLION) 82
TABLE 35 NEXT GENERATION MEMORY MARKET REVENUE, BY MEMORY TYPES, 2011 - 2017 ($BILLION) 83
TABLE 36 NEXT GENERATION MEMORY MARKET REVENUE, BY GEOGRAPHY,
2011 - 2017 ($BILLION) 85
TABLE 37 NEXT GENERATION MEMORY MARKET REVENUE, BY APPLICATIONS, 2011 - 2017 ($BILLION) 86
TABLE 38 ADVANTAGES AND CONCERNS FOR NEXT GENERATION MEMORIES 87
TABLE 39 GLOBAL MEMRISTOR MARKET, BY GEOGRAPHY,
2012 - 2017 ($BILLION) 89
TABLE 40 GLOBAL MRAM MARKET, BY GEOGRAPHY, 2012 - 2017 ($BILLION) 91
TABLE 41 PROS AND CONS OF PHASE CHANGE MEMORY (PCRAM) 92
TABLE 42 GLOBAL PCRAM MARKET, BY GEOGRAPHY, 2012 - 2017 ($BILLION) 93
TABLE 43 PROS AND CONS OF FEFET MEMORY (FERAM) TECHNOLOGY 95
TABLE 44 GLOBAL FERAM MARKET, BY GEOGRAPHY, 2012 - 2017 ($BILLION) 95
TABLE 45 GLOBAL MEMORY MARKET REVENUE, BY APPLICATIONS,
2011 - 2017 ($BILLION) 100
TABLE 46 COMPUTERS AND STORAGE ELECTRONICS MEMORY MARKET REVENUE, BY GEOGRAPHY, 2011 - 2017 ($BILLION) 103
TABLE 47 ICT MEMORY MARKET REVENUE, BY GEOGRAPHY,
2011 - 2017 ($BILLION) 105
TABLE 48 CONSUMER ELECTRONICS MEMORY MARKET REVENUE,
BY GEOGRAPHY, 2011 - 2017 ($BILLION) 107
TABLE 49 AUTOMOTIVE ELECTRONICS MEMORY MARKET REVENUE,
BY GEOGRAPHY, 2011 - 2017 ($BILLION) 109
TABLE 50 INDUSTRIAL MEMORY MARKET, BY GEOGRAPHY,
2011 - 2017 ($BILLION) 111
TABLE 51 AEROSPACE AND DEFENSE MEMORY MARKET REVENUE,
BY GEOGRAPHY, 2011 - 2017 ($BILLION) 113
TABLE 52 NORTH AMERICA: MEMORY MARKET REVENUE, BY TYPES,
2011 - 2017 ($BILLION) 116
TABLE 53 NORTH AMERICA: TRADITIONAL MEMORY MARKET REVENUE,
BY TYPES, 2011 - 2017 ($BILLION) 117
TABLE 54 NORTH AMERICA: TRADITIONAL MEMORY MARKET REVENUE,
BY APPLICATIONS, 2011 - 2017 ($BILLION) 118
TABLE 55 NORTH AMERICA NEXT GENERATION MEMORY MARKET, BY TYPE,
2012 - 2017 ($BILLION) 119
TABLE 56 NORTH AMERICA: NEXT GENERATION MEMORY MARKET REVENUE,
BY APPLICATIONS, 2011 - 2017 ($BILLION) 120
TABLE 57 EUROPE: MEMORY MARKET REVENUE, BY TYPES,
2011 - 2017 ($BILLION) 121
TABLE 58 EUROPE: TRADITIONAL MEMORY MARKET REVENUE, BY TYPES,
2011 - 2017 ($BILLION) 122
TABLE 59 EUROPE: TRADITIONAL MEMORY MARKET REVENUE, BY APPLICATIONS, 2011 - 2017 ($BILLION) 123
TABLE 60 EUROPE NEXT GENERATION MEMORY MARKET, BY TYPE,
2012 - 2017 ($BILLION) 124
TABLE 61 EUROPE: NEXT GENERATION MEMORY MARKET REVENUE,
BY APPLICATIONS, 2011 - 2017 ($BILLION) 125
TABLE 62 APAC: MEMORY MARKET REVENUE, BY TYPES, 2011 - 2017 ($BILLION) 127
TABLE 63 APAC: TRADITIONAL MEMORY MARKET REVENUE, BY TYPES,
2011 - 2017 ($BILLION) 128
TABLE 64 APAC: TRADITIONAL MEMORY MARKET REVENUE, BY APPLICATIONS, 2011 - 2017 ($BILLION) 129
TABLE 65 APAC NEXT GENERATION MEMORY MARKET, BY TYPE,
2012 - 2017 ($BILLION) 130
TABLE 66 APAC: NEXT GENERATION MEMORY MARKET REVENUE,
BY APPLICATIONS, 2011 - 2017 ($BILLION) 131
TABLE 67 ROW: MEMORY MARKET REVENUE, BY TYPES, 2011 - 2017 ($BILLION) 133
TABLE 68 ROW: TRADITIONAL MEMORY MARKET REVENUE, BY TYPES,
2011 - 2017 ($BILLION) 134
TABLE 69 ROW: TRADITIONAL MEMORY MARKET REVENUE, BY APPLICATIONS, 2011 - 2017 ($BILLION) 135
TABLE 70 ROW NEXT GENERATION MEMORY MARKET, BY TYPE,
2012 - 2017 ($BILLION) 136
TABLE 71 ROW NEXT GENERATION MEMORY MARKET REVENUE,
BY APPLICATIONS, 2011 - 2017 ($BILLION) 137
TABLE 72 TOP PLAYERS IN GLOBAL MEMORY MARKET, 2011 139
TABLE 73 TOP PLAYERS IN DRAM MARKET, 2011 140
TABLE 74 TOP PLAYERS IN MOBILE DRAM MARKET, 2011 141
TABLE 75 TOP PLAYERS IN NAND FLASH MARKET, 2011 142
TABLE 76 MERGERS & ACQUISITIONS, 2010 – 2012 143
TABLE 77 NEW PRODUCT LAUNCH/NEW PRODUCT DEVELOPMENT, 2010 – 2012 144
TABLE 78 COLLABORATIONS/PARTNERSHIPS/AGREEMENTS, 2010 – 2012 154
TABLE 79 CYPRESS SEMICONDUCTOR CORPORATION: BUSINESS SEGMENTS 161
TABLE 80 CYPRESS SEMICONDUCTOR CORPORATION: MARKET REVENUE,
2010 - 2011 ($MILLION) 162
TABLE 81 CYPRESS SEMICONDUCTOR CORPORATION: MARKET REVENUE,
BY PRODUCT SEGMENT, 2010 - 2011 ($MILLION) 162
TABLE 82 CYPRESS SEMICONDUCTOR CORPORATION: MARKET REVENUE,
BY GEOGRAPHY, 2010 - 2011 ($MILLION) 163
TABLE 83 FUJITSU: BUSINESS SEGMENTS 171
TABLE 84 FUJITSU: MARKET REVENUE, 2010 - 2011 ($BILLION) 172
TABLE 85 FUJITSU: MARKET REVENUE, BY PRODUCT SEGMENT,
2010 - 2011 ($BILLION) 173
TABLE 86 FUJITSU: MARKET REVENUE, BY GEOGRAPHY, 2010 - 2011 ($BILLION) 173
TABLE 87 GSI TECHNOLOGY: MARKET REVENUE, 2010 - 2011 ($MILLION) 177
TABLE 88 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.: BUSINESS SEGMENTS 180
TABLE 89 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.: MARKET REVENUE, 2010 - 2011 ($BILLION) 181
TABLE 90 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.: MARKET REVENUE, BY PRODUCT SEGMENTS, 2010 - 2011 ($BILLION) 181
TABLE 91 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.: MARKET REVENUE, BY GEOGRAPHY, 2010 - 2011 ($BILLION) 182
TABLE 92 IBM: BUSINESS SEGMENTS 185
TABLE 93 IBM: MARKET REVENUE, 2010 - 2011 ($BILLION) 185
TABLE 94 TOSHIBA CORPORATION: MARKET REVENUE, BY PRODUCT SEGMENT, 2010 - 2011 ($BILLION) 186
TABLE 95 IBM: MARKET REVENUE, BY GEOGRAPHY, 2010 - 2011 ($BILLION) 186
TABLE 96 INTEGRATED DEVICE TECHNOLOGY, INC.: PRODUCT SEGMENTS 189
TABLE 97 INTEGRATED DEVICE TECHNOLOGY, INC.: MARKET REVENUE,
2010 - 2011 ($MILLION) 190
TABLE 98 INTEGRATED DEVICE TECHNOLOGY, INC.: MARKET REVENUE,
BY PRODUCT SEGMENT, 2010 - 2011 ($MILLION) 190
TABLE 99 INTEGRATED DEVICE TECHNOLOGY, INC.: MARKET REVENUE,
BY GEOGRAPHY, 2010 - 2011 ($MILLION) 191
TABLE 100 ISSI: MARKET REVENUE, 2010 - 2011 ($MILLION) 194
TABLE 101 INTEL CORPORATION: MARKET REVENUE, 2010 - 2011 ($BILLION) 198
TABLE 102 INTEL CORPORATION: MARKET REVENUE, BY PRODUCT SEGMENTS, 2010 - 2011 ($BILLION) 198
TABLE 103 INTEL CORPORATION: MARKET REVENUE, BY GEOGRAPHY,
2010 - 2011 ($BILLION) 199
TABLE 104 MICRON TECHNOLOGY, INC. OFFERS BROAD PRODUCT LINE OF MEMORY PRODUCTS. 202
TABLE 105 MICRON TECHNOLOGY, INC.: MARKET REVENUE,
2010 - 2011 ($BILLION) 203
TABLE 106 MICRON TECHNOLOGY, INC.: MARKET REVENUE, BY GEOGRAPHY,
2010 - 2011 ($BILLION) 203
TABLE 107 NANYA TECHNOLOGY CORP.: MARKET REVENUE,
2010 - 2011 ($BILLION) 207
TABLE 108 NVE CORPORATION: MARKET REVENUE, 2010 - 2011 ($MILLION) 210
TABLE 109 NVE CORPORATION: MARKET REVENUE, BY GEOGRAPHY,
2010 - 2011 ($MILLION) 210
TABLE 110 PROMOS TECHNOLOGIES INC.: MARKET REVENUE,
2010 - 2011 ($MILLION) 215
TABLE 111 POWERCHIP TECHNOLOGY: PRODUCT SEGMENTS AND OFFERINGS 216
TABLE 112 POWERCHIP: OVERALL REVENUE, 2010-2011 ($BILLION) 217
TABLE 113 RAMBUS: PRODUCT SEGMENTS AND OFFERINGS 219
TABLE 114 RAMBUS: OVERALL REVENUE, 2010-2011 ($ MILLION) 219
TABLE 115 RAMTRON: OVERALL REVENUE, 2010-2012 ($ MILLION) 222
TABLE 116 PRODUCT SEGMENTS & OFFERINGS 225
TABLE 117 SAMSUNG: OVERALL REVENUE, 2010-2011 ($BILLION) 226
TABLE 118 SK HYNIX: PRODUCT SEGMENTS & OFFERINGS 228
TABLE 119 SK HYNIX: OVERALL REVENUE, 2010-2011 ($BILLION) 229
TABLE 120 SONY CORPORATION: MARKET REVENUE, 2010 - 2011 ($BILLION) 232
TABLE 121 SONY CORPORATION: MARKET REVENUE, BY PRODUCT SEGMENT,
2010 - 2011 ($BILLION) 232
TABLE 122 SONY CORPORATION: MARKET REVENUE, BY GEOGRAPHY,
2010 - 2011 ($BILLION) 233
TABLE 123 STMICROELECTRONICS: BUSINESS SEGMENTS 236
TABLE 124 STMICROELECTRONICS: MARKET REVENUE, 2010 - 2011 ($BILLION) 237
TABLE 125 STMICROELECTRONICS: MARKET REVENUE, BY PRODUCT SEGMENT, 2010 - 2011 ($BILLION) 237
TABLE 126 STMICROELECTRONICS: MARKET REVENUE, BY GEOGRAPHY,
2010 - 2011 ($BILLION) 238
TABLE 127 TEXAS INSTRUMENTS INCORPORATED: BUSINESS SEGMENTS 241
TABLE 128 TEXAS INSTRUMENTS INCORPORATED: MARKET REVENUE,
2010 - 2011 ($BILLION) 242
TABLE 129 TEXAS INSTRUMENTS INCORPORATED: MARKET REVENUE,
BY PRODUCT SEGMENT, 2010 - 2011 ($BILLION) 242
TABLE 130 TEXAS INSTRUMENTS INCORPORATED: MARKET REVENUE,
BY GEOGRAPHY, 2010 - 2011 ($BILLION) 243
TABLE 131 TOSHIBA CORPORATION: BUSINESS SEGMENTS 246
TABLE 132 TOSHIBA CORPORATION: MARKET REVENUE, 2010 - 2011 ($BILLION) 247
TABLE 133 TOSHIBA CORPORATION: MARKET REVENUE, BY PRODUCT,
2010 - 2011 ($BILLION) 247
TABLE 134 TOSHIBA CORPORATION: MARKET REVENUE, BY GEOGRAPHY,
2010 - 2011 ($BILLION) 248
TABLE 135 WINBOND ELECTRONICS CORP.: BUSINESS SEGMENTS 251
TABLE 136 WINBOND ELECTRONICS CORP.: MARKET REVENUE,
2010 - 2011 ($MILLION) 251
TABLE 137 WINBOND ELECTRONICS CORP.: MARKET REVENUE,
BY PRODUCT SEGMENT, 2010 - 2011 ($MILLION) 252
TABLE 138 WINBOND ELECTRONICS CORP.: MARKET REVENUE, BY GEOGRAPHY, 2010 - 2011 ($MILLION) 252

LIST OF FIGURES

FIGURE 1 RESEARCH METHODOLOGY TO DERIVE THE MARKET SIZE 23
FIGURE 2 NEXT GENERATION MEMORY TECHNOLOGY MARKET SEGMENTATION 32
FIGURE 3 GENERAL MEMORY CLASSIFICATION 33
FIGURE 4 IMPACT ANALYSIS OF DRIVERS 38
FIGURE 5 MEMORY CONSUMPTION, 2008 - 2015 ($MILLION) 41
FIGURE 6 IMPACT ANALYSIS OF RESTRAINTS 42
FIGURE 7 FLASH MEMORY MARKET 47
FIGURE 8 VALUE CHAIN OF MEMORY MARKET 49
FIGURE 9 MEMORY MARKET LIFE CYCLE 50
FIGURE 10 PORTER'S FIVE FORCE MODEL 51
FIGURE 11 MARKET PENTRATION, 2012 & 2017 55
FIGURE 12 AVERAGE SELLING PRICE FORECAST OF DRAM 62
FIGURE 13 ZRAM COMPARED WITH DRAM AND SRAM 96
FIGURE 14 PERCENTAGE SPLIT OF TOTAL MEMORY MARKET,
BY APPLICATIONS, 2012 & 2017 101
FIGURE 15 PERCENTAGE SPLIT OF MEMORY MARKET, BY GEOGRAPHY,
2012 & 2017 115

To order this report:
Electronic_Component_and_Semiconductor Industry:
Global Next Generation Memory Market (2012 -2017), By Technology (DRAM, SRAM, Flash Memory, Memristor, Magneto Resistive RAM (MRAM), Phase Change RAM (PCRAM), Ferroelectric RAM), Application & Geography

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@ThingsExpo Stories
In his session at @ThingsExpo, Dr. Robert Cohen, an economist and senior fellow at the Economic Strategy Institute, presented the findings of a series of six detailed case studies of how large corporations are implementing IoT. The session explored how IoT has improved their economic performance, had major impacts on business models and resulted in impressive ROIs. The companies covered span manufacturing and services firms. He also explored servicification, how manufacturing firms shift from se...
The question before companies today is not whether to become intelligent, it’s a question of how and how fast. The key is to adopt and deploy an intelligent application strategy while simultaneously preparing to scale that intelligence. In her session at 21st Cloud Expo, Sangeeta Chakraborty, Chief Customer Officer at Ayasdi, will provide a tactical framework to become a truly intelligent enterprise, including how to identify the right applications for AI, how to build a Center of Excellence to ...
SYS-CON Events announced today that Massive Networks will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Massive Networks mission is simple. To help your business operate seamlessly with fast, reliable, and secure internet and network solutions. Improve your customer's experience with outstanding connections to your cloud.
SYS-CON Events announced today that CAST Software will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 - Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. CAST was founded more than 25 years ago to make the invisible visible. Built around the idea that even the best analytics on the market still leave blind spots for technical teams looking to deliver better software and prevent outages, CAST provides the software intelligence that matter ...
Everything run by electricity will eventually be connected to the Internet. Get ahead of the Internet of Things revolution and join Akvelon expert and IoT industry leader, Sergey Grebnov, in his session at @ThingsExpo, for an educational dive into the world of managing your home, workplace and all the devices they contain with the power of machine-based AI and intelligent Bot services for a completely streamlined experience.
Because IoT devices are deployed in mission-critical environments more than ever before, it’s increasingly imperative they be truly smart. IoT sensors simply stockpiling data isn’t useful. IoT must be artificially and naturally intelligent in order to provide more value In his session at @ThingsExpo, John Crupi, Vice President and Engineering System Architect at Greenwave Systems, will discuss how IoT artificial intelligence (AI) can be carried out via edge analytics and machine learning techn...
SYS-CON Events announced today that Datera, that offers a radically new data management architecture, has been named "Exhibitor" of SYS-CON's 21st International Cloud Expo ®, which will take place on Oct 31 - Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Datera is transforming the traditional datacenter model through modern cloud simplicity. The technology industry is at another major inflection point. The rise of mobile, the Internet of Things, data storage and Big...
In his session at @ThingsExpo, Arvind Radhakrishnen discussed how IoT offers new business models in banking and financial services organizations with the capability to revolutionize products, payments, channels, business processes and asset management built on strong architectural foundation. The following topics were covered: How IoT stands to impact various business parameters including customer experience, cost and risk management within BFS organizations.
SYS-CON Events announced today that CA Technologies has been named "Platinum Sponsor" of SYS-CON's 21st International Cloud Expo®, which will take place October 31-November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. CA Technologies helps customers succeed in a future where every business - from apparel to energy - is being rewritten by software. From planning to development to management to security, CA creates software that fuels transformation for companies in the applic...
SYS-CON Events announced today that Pulzze Systems will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place October 31-November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Pulzze Systems Inc, provides the software product "The Interactor" that uniquely simplifies building IoT, Web and Smart Enterprise Solutions. It is a Silicon Valley startup funded by US government agencies, NSF and DHS to bring innovative solutions to market.
From 2013, NTT Communications has been providing cPaaS service, SkyWay. Its customer’s expectations for leveraging WebRTC technology are not only typical real-time communication use cases such as Web conference, remote education, but also IoT use cases such as remote camera monitoring, smart-glass, and robotic. Because of this, NTT Communications has numerous IoT business use-cases that its customers are developing on top of PaaS. WebRTC will lead IoT businesses to be more innovative and address...
WebRTC is great technology to build your own communication tools. It will be even more exciting experience it with advanced devices, such as a 360 Camera, 360 microphone, and a depth sensor camera. In his session at @ThingsExpo, Masashi Ganeko, a manager at INFOCOM Corporation, will introduce two experimental projects from his team and what they learned from them. "Shotoku Tamago" uses the robot audition software HARK to track speakers in 360 video of a remote party. "Virtual Teleport" uses a...
When shopping for a new data processing platform for IoT solutions, many development teams want to be able to test-drive options before making a choice. Yet when evaluating an IoT solution, it’s simply not feasible to do so at scale with physical devices. Building a sensor simulator is the next best choice; however, generating a realistic simulation at very high TPS with ease of configurability is a formidable challenge. When dealing with multiple application or transport protocols, you would be...
SYS-CON Events announced today that CA Technologies has been named “Platinum Sponsor” of SYS-CON's 21st International Cloud Expo®, which will take place October 31-November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. CA Technologies helps customers succeed in a future where every business – from apparel to energy – is being rewritten by software. From planning to development to management to security, CA creates software that fuels transformation for companies in the applic...
SYS-CON Events announced today that Elastifile will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 - Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Elastifile Cloud File System (ECFS) is software-defined data infrastructure designed for seamless and efficient management of dynamic workloads across heterogeneous environments. Elastifile provides the architecture needed to optimize your hybrid cloud environment, by facilitating efficient...
SYS-CON Events announced today that Golden Gate University will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Since 1901, non-profit Golden Gate University (GGU) has been helping adults achieve their professional goals by providing high quality, practice-based undergraduate and graduate educational programs in law, taxation, business and related professions. Many of its courses are taug...
Recently, WebRTC has a lot of eyes from market. The use cases of WebRTC are expanding - video chat, online education, online health care etc. Not only for human-to-human communication, but also IoT use cases such as machine to human use cases can be seen recently. One of the typical use-case is remote camera monitoring. With WebRTC, people can have interoperability and flexibility for deploying monitoring service. However, the benefit of WebRTC for IoT is not only its convenience and interopera...
When shopping for a new data processing platform for IoT solutions, many development teams want to be able to test-drive options before making a choice. Yet when evaluating an IoT solution, it’s simply not feasible to do so at scale with physical devices. Building a sensor simulator is the next best choice; however, generating a realistic simulation at very high TPS with ease of configurability is a formidable challenge. When dealing with multiple application or transport protocols, you would be...
WebRTC is the future of browser-to-browser communications, and continues to make inroads into the traditional, difficult, plug-in web communications world. The 6th WebRTC Summit continues our tradition of delivering the latest and greatest presentations within the world of WebRTC. Topics include voice calling, video chat, P2P file sharing, and use cases that have already leveraged the power and convenience of WebRTC.
An increasing number of companies are creating products that combine data with analytical capabilities. Running interactive queries on Big Data requires complex architectures to store and query data effectively, typically involving data streams, an choosing efficient file format/database and multiple independent systems that are tied together through custom-engineered pipelines. In his session at @BigDataExpo at @ThingsExpo, Tomer Levi, a senior software engineer at Intel’s Advanced Analytics ...