Welcome!

IBM Cloud Authors: William Schmarzo, Pat Romanski, Elizabeth White, Yeshim Deniz, Liz McMillan

News Feed Item

Molex Brings Wide-Range of Advanced Interconnect Solutions and Expertise to DesignCon

Molex Incorporated continues to meet the needs of today’s design engineers by developing products that provide not only the highest signal speeds and integrity on the market, but also offer flexibility and scalability for next-generation system architectures. Molex will showcase its expertise in various forums at DesignCon 2013, January 28 – 31, 2013, Santa Clara, CA, including several technical paper presentations and ongoing solution demonstrations and product displays in booth 109.

Technical Paper Presentations

Each of these three 40-minute sessions highlights specific Molex technical and application expertise:

  • Tuesday, January 29, 2013, 9:20 a.m. – 10:00 a.m. Ballroom H: Molex experts Gregory Fitzgerald, senior signal integrity engineer; Munawar Ahmad, principal engineer; Mark Bugg, project engineer and Michael Rost, project electrical engineer will discuss skew in twinax cables and its significance in next-generation differential signalling. Both insertion loss deviation and mode conversion will also be reviewed.
  • Wednesday, January 30, 2013, 2:00 p.m. – 2:40 p.m. Ballroom E: Rick Brandwein, electrical project engineer, Molex; Glenn Oliver, senior engineer, DuPont; Matt Doyle, signal integrity engineer, IBM; and John Dangler, development engineer, IBM will demonstrate how a focus on advanced flex circuit materials will enable flex circuits to remain valid interconnects. Modeled and measured data will characterize construct performance and “lessons learned" will be presented.
  • Thursday, January 31, 2013, 10:40 a.m. – 11:20 a.m. Ballroom G: Peerouz Amleshi, director; Xin Wu, senior engineer and Raghav Nallan Chakaavarthi, electrical engineer with Molex will join Bhavesh Patel, principal engineer, Dell and Casey Morrison, application engineer, Texas Instruments to identify the critical system signal integrity and radiated EMI impact factors of the conventional implementation of AC coupling capacitors in a 25Gbps+ system through 3D modeling, channel simulation and measurement.

Product Demonstrations

The demonstrations will take place in Molex booth 109 and highlight the company’s commitment to developing next-generation solutions for its customers:

  • NeoScale™ 28 Gbps Speeds: Adam Stanczak, product development manager, and Vivek Shah, senior electrical engineer, will conduct a live demonstration of the latest derivatives and extensions of the NeoScale connector, a high-speed mezzanine solution that delivers pristine signal integrity at 28 Gbps+ data rates. The demonstration will feature an integrated test board, a Molex connector, a Texas Instruments chip, LeCroy test equipment and cutting edge product extensions of the NeoScale design. For more information, please visit www.molex.com/link/neoscale.html.
  • zQSFP+: Joe Dambach, global new product development manager, will demonstrate zQSFP+ stacked thermal management technologies. Wind tunnel testing has been found to offer the most accurate, repeatable test method. Data is generated that will support design of NEBS rated applications with current and next generation pluggable I/O modules. For more information, please visit www.molex.com/link/zqsfp+.html.
  • Impel™ Backplane Connector System: Pete Soupir, global new product development manager, will be demonstrating the new Impel backplane technology operating at 25 Gbps over 3 different channel lengths using the Impel reference backplane. The output will illustrate the Impel connector performance in-channel using Megtron 6 and HVLP board material with respective transmit and receive daughtercards. For more information, www.molex.com/link/backplane.htm.

Products Displayed

Molex will display a range of advanced interconnect products, including:

Power:

  • EXTreme EnergetiC™ High-Current Connector System: Delivers high-end datacom OEMs and power supply manufacturers with an advanced solution for applications requiring high current up to 100.0A per bay
  • EXTreme Guardian™ System: Winner of the 2012 DesignVision Award, the solution features a three circuit, wire-to-board configuration that delivers up to 80.0A of current per circuit, a PCB header with a pitch of 11.00 mm (0.433”) for increased PCB real estate savings and an EMI-shielding option to reduce cable crosstalk and improve immunity to external noise

I/O

  • zQSFP+™ Stacked with Thermal Management Component (TMC): Continues to support 100 Gbps Ethernet and 100 Gbps InfiniBand* (IB) Enhanced Data Rate (EDR) applications, the zQSFP+ TMC offers improved thermal performance by cooling both the upper and lower ports in order to conform to NEBS or other applications that required higher ambient temperatures of up to +55ºC
  • zQSFP+ iPass+™ zHD Vertical Connector System: Provides a 0.75mm pitch vertical connector that meets requirements of SAS-3 and projected SAS-4 bandwidth

Mezzanine

  • NeoScale™ High-Speed Mezzanine System: Offers 2, 4, 6 and 8 row versions with a column range of 4 to 30 columns and stack heights of 12.00 to 42.00mm to support a wide range of mezzanine applications
  • SpeedStack™ Connector System: Provides PCB real-estate space savings while optimizing airflow with a low-profile stack height of 4.00mm, achieving up to 40 Gbps per differential pair

Backplane

  • Impel™ Backplane Connector System: This scalable backplane product provides OEMs with an upgrade model, so that they can purchase a reduced cost daughtercard that is a viable solution for 16 Gbps, and can upgrade to a plug-compatible daughtercard solution for 25 Gbps or beyond.
  • Impact™ XTR Daughter Cards: A daughtercard enhancement of the Impact product family, XTR provides an upgrade path for increased signal integrity margin necessary for evolving high-speed development, supporting 25 Gbps+.

To receive information on other Molex products and industry solutions, please sign up for our e-nouncement newsletter at www.molex.com/link/register/.

About Molex Incorporated

Providing more than connectors, Molex delivers complete interconnect solutions for a number of markets including data communications, telecommunications, consumer electronics, industrial, automotive, medical, military and lighting. Established in 1938, the company operates 40 manufacturing locations in 16 countries. The Molex website is http://www.molex.com. Follow us at http://www.twitter.com/molexconnectors watch our videos at http://www.youtube.com/molexconnectors, connect with us at http://www.facebook.com/molexconnectors and read our blog at http://www.connector.com.

Molex is a registered trademark of Molex Incorporated

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

@ThingsExpo Stories
With major technology companies and startups seriously embracing Cloud strategies, now is the perfect time to attend @CloudExpo | @ThingsExpo, June 6-8, 2017, at the Javits Center in New York City, NY and October 31 - November 2, 2017, Santa Clara Convention Center, CA. Learn what is going on, contribute to the discussions, and ensure that your enterprise is on the right path to Digital Transformation.
SYS-CON Events announced today that EARP Integration will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. EARP Integration is a passionate software house. Since its inception in 2009 the company successfully delivers smart solutions for cities and factories that start their digital transformation. EARP provides bespoke solutions like, for example, advanced enterprise portals, business intelligence systems an...
Existing Big Data solutions are mainly focused on the discovery and analysis of data. The solutions are scalable and highly available but tedious when swapping in and swapping out occurs in disarray and thrashing takes place. The resolution for thrashing through machine learning algorithms and support nomenclature is through simple techniques. Organizations that have been collecting large customer data are increasingly seeing the need to use the data for swapping in and out and thrashing occurs ...
Amazon started as an online bookseller 20 years ago. Since then, it has evolved into a technology juggernaut that has disrupted multiple markets and industries and touches many aspects of our lives. It is a relentless technology and business model innovator driving disruption throughout numerous ecosystems. Amazon’s AWS revenues alone are approaching $16B a year making it one of the largest IT companies in the world. With dominant offerings in Cloud, IoT, eCommerce, Big Data, AI, Digital Assis...
SYS-CON Events announced today that Progress, a global leader in application development, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Enterprises today are rapidly adopting the cloud, while continuing to retain business-critical/sensitive data inside the firewall. This is creating two separate data silos – one inside the firewall and the other outside the firewall. Cloud ISVs oft...
The 21st International Cloud Expo has announced that its Call for Papers is open. Cloud Expo, to be held October 31 - November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA, brings together Cloud Computing, Big Data, Internet of Things, DevOps, Digital Transformation, Machine Learning and WebRTC to one location. With cloud computing driving a higher percentage of enterprise IT budgets every year, it becomes increasingly important to plant your flag in this fast-expanding busin...
Internet of @ThingsExpo, taking place October 31 - November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with the 21st International Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. @ThingsExpo Silicon Valley Call for Papers is now open.
As cloud adoption continues to transform business, today's global enterprises are challenged with managing a growing amount of information living outside of the data center. The rapid adoption of IoT and increasingly mobile workforce are exacerbating the problem. Ensuring secure data sharing and efficient backup poses capacity and bandwidth considerations as well as policy and regulatory compliance issues.
SYS-CON Events announced today that Interoute has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Interoute is the owner operator of Europe's largest network and a global cloud services platform, which encompasses over 70,000 km of lit fiber, 15 data centers, 17 virtual data centers and 33 colocation centers, with connections to 195 additional partner data centers. Our full-service Unifie...
In order to meet the rapidly changing demands of today’s customers, companies are continually forced to redefine their business strategies in order to meet these needs, stay relevant and continue to see profitable growth. IoT deployment and development is integral in this transformation, and today businesses are increasingly seeing the value of investing their resources into IoT deployments. These technologies are able increase ROI through projects such as connecting supply chains or enabling sm...
SYS-CON Events announced today that Progress, a global leader in application development, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Enterprises today are rapidly adopting the cloud, while continuing to retain business-critical/sensitive data inside the firewall. This is creating two separate data silos – one inside the firewall and the other outside the firewall. Cloud ISVs ofte...
DevOps is often described as a combination of technology and culture. Without both, DevOps isn't complete. However, applying the culture to outdated technology is a recipe for disaster; as response times grow and connections between teams are delayed by technology, the culture will die. A Nutanix Enterprise Cloud has many benefits that provide the needed base for a true DevOps paradigm.
SYS-CON Events announced today that DivvyCloud will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. DivvyCloud software enables organizations to achieve their cloud computing goals by simplifying and automating security, compliance and cost optimization of public and private cloud infrastructure. Using DivvyCloud, customers can leverage programmatic Bots to identify and remediate common cloud problems in rea...
SYS-CON Events announced today that Outscale, a global pure play Infrastructure as a Service provider and strategic partner of Dassault Systèmes, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Founded in 2010, Outscale simplifies infrastructure complexities and boosts the business agility of its customers. Outscale delivers a secure, reliable and industrial strength solution for its customers, which in...
SYS-CON Events announced today that Cloudistics, an on-premises cloud computing company, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Cloudistics delivers a complete public cloud experience with composable on-premises infrastructures to medium and large enterprises. Its software-defined technology natively converges network, storage, compute, virtualization, and management into a ...
New competitors, disruptive technologies, and growing expectations are pushing every business to both adopt and deliver new digital services. This ‘Digital Transformation’ demands rapid delivery and continuous iteration of new competitive services via multiple channels, which in turn demands new service delivery techniques – including DevOps. In this power panel at @DevOpsSummit 20th Cloud Expo, moderated by DevOps Conference Co-Chair Andi Mann, panelists will examine how DevOps helps to meet th...
SYS-CON Events announced today that A&I Solutions has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Founded in 1999, A&I Solutions is a leading information technology (IT) software and services provider focusing on best-in-class enterprise solutions. By partnering with industry leaders in technology, A&I assures customers high performance levels across all IT environments including: mai...
Every successful software product evolves from an idea to an enterprise system. Notably, the same way is passed by the product owner's company. In his session at 20th Cloud Expo, Oleg Lola, CEO of MobiDev, will provide a generalized overview of the evolution of a software product, the product owner, the needs that arise at various stages of this process, and the value brought by a software development partner to the product owner as a response to these needs.
Most technology leaders, contemporary and from the hardware era, are reshaping their businesses to do software in the hope of capturing value in IoT. Although IoT is relatively new in the market, it has already gone through many promotional terms such as IoE, IoX, SDX, Edge/Fog, Mist Compute, etc. Ultimately, irrespective of the name, it is about deriving value from independent software assets participating in an ecosystem as one comprehensive solution.
SYS-CON Events announced today that EARP will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. "We are a software house, so we perfectly understand challenges that other software houses face in their projects. We can augment a team, that will work with the same standards and processes as our partners' internal teams. Our teams will deliver the same quality within the required time and budget just as our partn...