Welcome!

IBM Cloud Authors: Pat Romanski, Elizabeth White, Gordon Haff, Liz McMillan, Kevin Benedict

News Feed Item

Molex Brings Wide-Range of Advanced Interconnect Solutions and Expertise to DesignCon

Molex Incorporated continues to meet the needs of today’s design engineers by developing products that provide not only the highest signal speeds and integrity on the market, but also offer flexibility and scalability for next-generation system architectures. Molex will showcase its expertise in various forums at DesignCon 2013, January 28 – 31, 2013, Santa Clara, CA, including several technical paper presentations and ongoing solution demonstrations and product displays in booth 109.

Technical Paper Presentations

Each of these three 40-minute sessions highlights specific Molex technical and application expertise:

  • Tuesday, January 29, 2013, 9:20 a.m. – 10:00 a.m. Ballroom H: Molex experts Gregory Fitzgerald, senior signal integrity engineer; Munawar Ahmad, principal engineer; Mark Bugg, project engineer and Michael Rost, project electrical engineer will discuss skew in twinax cables and its significance in next-generation differential signalling. Both insertion loss deviation and mode conversion will also be reviewed.
  • Wednesday, January 30, 2013, 2:00 p.m. – 2:40 p.m. Ballroom E: Rick Brandwein, electrical project engineer, Molex; Glenn Oliver, senior engineer, DuPont; Matt Doyle, signal integrity engineer, IBM; and John Dangler, development engineer, IBM will demonstrate how a focus on advanced flex circuit materials will enable flex circuits to remain valid interconnects. Modeled and measured data will characterize construct performance and “lessons learned" will be presented.
  • Thursday, January 31, 2013, 10:40 a.m. – 11:20 a.m. Ballroom G: Peerouz Amleshi, director; Xin Wu, senior engineer and Raghav Nallan Chakaavarthi, electrical engineer with Molex will join Bhavesh Patel, principal engineer, Dell and Casey Morrison, application engineer, Texas Instruments to identify the critical system signal integrity and radiated EMI impact factors of the conventional implementation of AC coupling capacitors in a 25Gbps+ system through 3D modeling, channel simulation and measurement.

Product Demonstrations

The demonstrations will take place in Molex booth 109 and highlight the company’s commitment to developing next-generation solutions for its customers:

  • NeoScale™ 28 Gbps Speeds: Adam Stanczak, product development manager, and Vivek Shah, senior electrical engineer, will conduct a live demonstration of the latest derivatives and extensions of the NeoScale connector, a high-speed mezzanine solution that delivers pristine signal integrity at 28 Gbps+ data rates. The demonstration will feature an integrated test board, a Molex connector, a Texas Instruments chip, LeCroy test equipment and cutting edge product extensions of the NeoScale design. For more information, please visit www.molex.com/link/neoscale.html.
  • zQSFP+: Joe Dambach, global new product development manager, will demonstrate zQSFP+ stacked thermal management technologies. Wind tunnel testing has been found to offer the most accurate, repeatable test method. Data is generated that will support design of NEBS rated applications with current and next generation pluggable I/O modules. For more information, please visit www.molex.com/link/zqsfp+.html.
  • Impel™ Backplane Connector System: Pete Soupir, global new product development manager, will be demonstrating the new Impel backplane technology operating at 25 Gbps over 3 different channel lengths using the Impel reference backplane. The output will illustrate the Impel connector performance in-channel using Megtron 6 and HVLP board material with respective transmit and receive daughtercards. For more information, www.molex.com/link/backplane.htm.

Products Displayed

Molex will display a range of advanced interconnect products, including:

Power:

  • EXTreme EnergetiC™ High-Current Connector System: Delivers high-end datacom OEMs and power supply manufacturers with an advanced solution for applications requiring high current up to 100.0A per bay
  • EXTreme Guardian™ System: Winner of the 2012 DesignVision Award, the solution features a three circuit, wire-to-board configuration that delivers up to 80.0A of current per circuit, a PCB header with a pitch of 11.00 mm (0.433”) for increased PCB real estate savings and an EMI-shielding option to reduce cable crosstalk and improve immunity to external noise

I/O

  • zQSFP+™ Stacked with Thermal Management Component (TMC): Continues to support 100 Gbps Ethernet and 100 Gbps InfiniBand* (IB) Enhanced Data Rate (EDR) applications, the zQSFP+ TMC offers improved thermal performance by cooling both the upper and lower ports in order to conform to NEBS or other applications that required higher ambient temperatures of up to +55ºC
  • zQSFP+ iPass+™ zHD Vertical Connector System: Provides a 0.75mm pitch vertical connector that meets requirements of SAS-3 and projected SAS-4 bandwidth

Mezzanine

  • NeoScale™ High-Speed Mezzanine System: Offers 2, 4, 6 and 8 row versions with a column range of 4 to 30 columns and stack heights of 12.00 to 42.00mm to support a wide range of mezzanine applications
  • SpeedStack™ Connector System: Provides PCB real-estate space savings while optimizing airflow with a low-profile stack height of 4.00mm, achieving up to 40 Gbps per differential pair

Backplane

  • Impel™ Backplane Connector System: This scalable backplane product provides OEMs with an upgrade model, so that they can purchase a reduced cost daughtercard that is a viable solution for 16 Gbps, and can upgrade to a plug-compatible daughtercard solution for 25 Gbps or beyond.
  • Impact™ XTR Daughter Cards: A daughtercard enhancement of the Impact product family, XTR provides an upgrade path for increased signal integrity margin necessary for evolving high-speed development, supporting 25 Gbps+.

To receive information on other Molex products and industry solutions, please sign up for our e-nouncement newsletter at www.molex.com/link/register/.

About Molex Incorporated

Providing more than connectors, Molex delivers complete interconnect solutions for a number of markets including data communications, telecommunications, consumer electronics, industrial, automotive, medical, military and lighting. Established in 1938, the company operates 40 manufacturing locations in 16 countries. The Molex website is http://www.molex.com. Follow us at http://www.twitter.com/molexconnectors watch our videos at http://www.youtube.com/molexconnectors, connect with us at http://www.facebook.com/molexconnectors and read our blog at http://www.connector.com.

Molex is a registered trademark of Molex Incorporated

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

@ThingsExpo Stories
The explosion of new web/cloud/IoT-based applications and the data they generate are transforming our world right before our eyes. In this rush to adopt these new technologies, organizations are often ignoring fundamental questions concerning who owns the data and failing to ask for permission to conduct invasive surveillance of their customers. Organizations that are not transparent about how their systems gather data telemetry without offering shared data ownership risk product rejection, regu...
Who are you? How do you introduce yourself? Do you use a name, or do you greet a friend by the last four digits of his social security number? Assuming you don’t, why are we content to associate our identity with 10 random digits assigned by our phone company? Identity is an issue that affects everyone, but as individuals we don’t spend a lot of time thinking about it. In his session at @ThingsExpo, Ben Klang, Founder & President of Mojo Lingo, discussed the impact of technology on identity. Sho...
There are 66 million network cameras capturing terabytes of data. How did factories in Japan improve physical security at the facilities and improve employee productivity? Edge Computing reduces possible kilobytes of data collected per second to only a few kilobytes of data transmitted to the public cloud every day. Data is aggregated and analyzed close to sensors so only intelligent results need to be transmitted to the cloud. Non-essential data is recycled to optimize storage.
In his keynote at @ThingsExpo, Chris Matthieu, Director of IoT Engineering at Citrix and co-founder and CTO of Octoblu, focused on building an IoT platform and company. He provided a behind-the-scenes look at Octoblu’s platform, business, and pivots along the way (including the Citrix acquisition of Octoblu).
In his keynote at 18th Cloud Expo, Andrew Keys, Co-Founder of ConsenSys Enterprise, provided an overview of the evolution of the Internet and the Database and the future of their combination – the Blockchain. Andrew Keys is Co-Founder of ConsenSys Enterprise. He comes to ConsenSys Enterprise with capital markets, technology and entrepreneurial experience. Previously, he worked for UBS investment bank in equities analysis. Later, he was responsible for the creation and distribution of life settle...
SYS-CON Events announced today that SD Times | BZ Media has been named “Media Sponsor” of SYS-CON's 20th International Cloud Expo, which will take place on June 6–8, 2017, at the Javits Center in New York City, NY. BZ Media LLC is a high-tech media company that produces technical conferences and expositions, and publishes a magazine, newsletters and websites in the software development, SharePoint, mobile development and commercial UAV markets.
“We're a global managed hosting provider. Our core customer set is a U.S.-based customer that is looking to go global,” explained Adam Rogers, Managing Director at ANEXIA, in this SYS-CON.tv interview at 18th Cloud Expo, held June 7-9, 2016, at the Javits Center in New York City, NY.
In today's uber-connected, consumer-centric, cloud-enabled, insights-driven, multi-device, global world, the focus of solutions has shifted from the product that is sold to the person who is buying the product or service. Enterprises have rebranded their business around the consumers of their products. The buyer is the person and the focus is not on the offering. The person is connected through multiple devices, wearables, at home, on the road, and in multiple locations, sometimes simultaneously...
China Unicom exhibit at the 19th International Cloud Expo, which took place at the Santa Clara Convention Center in Santa Clara, CA, in November 2016. China United Network Communications Group Co. Ltd ("China Unicom") was officially established in 2009 on the basis of the merger of former China Netcom and former China Unicom. China Unicom mainly operates a full range of telecommunications services including mobile broadband (GSM, WCDMA, LTE FDD, TD-LTE), fixed-line broadband, ICT, data communica...
As businesses adopt functionalities in cloud computing, it’s imperative that IT operations consistently ensure cloud systems work correctly – all of the time, and to their best capabilities. In his session at @BigDataExpo, Bernd Harzog, CEO and founder of OpsDataStore, will present an industry answer to the common question, “Are you running IT operations as efficiently and as cost effectively as you need to?” He will expound on the industry issues he frequently came up against as an analyst, and...
WebRTC is about the data channel as much as about video and audio conferencing. However, basically all commercial WebRTC applications have been built with a focus on audio and video. The handling of “data” has been limited to text chat and file download – all other data sharing seems to end with screensharing. What is holding back a more intensive use of peer-to-peer data? In her session at @ThingsExpo, Dr Silvia Pfeiffer, WebRTC Applications Team Lead at National ICT Australia, looked at differ...
With major technology companies and startups seriously embracing IoT strategies, now is the perfect time to attend @ThingsExpo 2016 in New York. Learn what is going on, contribute to the discussions, and ensure that your enterprise is as "IoT-Ready" as it can be! Internet of @ThingsExpo, taking place June 6-8, 2017, at the Javits Center in New York City, New York, is co-located with 20th Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry p...
IoT offers a value of almost $4 trillion to the manufacturing industry through platforms that can improve margins, optimize operations & drive high performance work teams. By using IoT technologies as a foundation, manufacturing customers are integrating worker safety with manufacturing systems, driving deep collaboration and utilizing analytics to exponentially increased per-unit margins. However, as Benoit Lheureux, the VP for Research at Gartner points out, “IoT project implementers often un...
SYS-CON Events announced today that Technologic Systems Inc., an embedded systems solutions company, will exhibit at SYS-CON's @ThingsExpo, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Technologic Systems is an embedded systems company with headquarters in Fountain Hills, Arizona. They have been in business for 32 years, helping more than 8,000 OEM customers and building over a hundred COTS products that have never been discontinued. Technologic Systems’ pr...
SYS-CON Events announced today that IoT Now has been named “Media Sponsor” of SYS-CON's 20th International Cloud Expo, which will take place on June 6–8, 2017, at the Javits Center in New York City, NY. IoT Now explores the evolving opportunities and challenges facing CSPs, and it passes on some lessons learned from those who have taken the first steps in next-gen IoT services.
SYS-CON Events announced today that WineSOFT will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Based in Seoul and Irvine, WineSOFT is an innovative software house focusing on internet infrastructure solutions. The venture started as a bootstrap start-up in 2010 by focusing on making the internet faster and more powerful. WineSOFT’s knowledge is based on the expertise of TCP/IP, VPN, SSL, peer-to-peer, mob...
SYS-CON Events announced today that delaPlex will exhibit at SYS-CON's @CloudExpo, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. delaPlex pioneered Software Development as a Service (SDaaS), which provides scalable resources to build, test, and deploy software. It’s a fast and more reliable way to develop a new product or expand your in-house team.
The security needs of IoT environments require a strong, proven approach to maintain security, trust and privacy in their ecosystem. Assurance and protection of device identity, secure data encryption and authentication are the key security challenges organizations are trying to address when integrating IoT devices. This holds true for IoT applications in a wide range of industries, for example, healthcare, consumer devices, and manufacturing. In his session at @ThingsExpo, Lancen LaChance, vic...
With billions of sensors deployed worldwide, the amount of machine-generated data will soon exceed what our networks can handle. But consumers and businesses will expect seamless experiences and real-time responsiveness. What does this mean for IoT devices and the infrastructure that supports them? More of the data will need to be handled at - or closer to - the devices themselves.
You think you know what’s in your data. But do you? Most organizations are now aware of the business intelligence represented by their data. Data science stands to take this to a level you never thought of – literally. The techniques of data science, when used with the capabilities of Big Data technologies, can make connections you had not yet imagined, helping you discover new insights and ask new questions of your data. In his session at @ThingsExpo, Sarbjit Sarkaria, data science team lead ...