|By PR Newswire||
|January 21, 2013 06:52 AM EST||
NEW YORK, Jan. 21, 2013 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:
A 2X GROWTH IS EXPECTED IN THE NEXT 5 YEARS WITHIN THE ELECTRONICS INDUSTRY
From a commodity technology initially developed to replace bulky discrete passive components, thin-film Integrated Passive Devices (IPDs) are now a growing industry trend driven by RF, High Brightness LEDs, ESD and EMI protection, and Digital and Mixed Signal applications. This new research study on thin-film Integrated Passive and Active Devices estimates the total IPD market to grow from more than $610M this year to over $1.2B by 2017 with a CAGR of 12%.
ESD and EMI protection IPD revenues are stabilizing, primarily due to the recent decline of NOKIA in the mobile space. NOKIA has been the main driving OEM for the integration of IPDs in volume, with many handsets having from 10 to 15 ESD and EMI protection IPDs per system. It remains to be seen which OEMs will take over NOKIA's leadership in the integration of IPDs? If Sony-Ericsson and Motorola have adopted the technology to limited volume, Apple recently started to adopt more and more IPD components into its end-products, while Samsung recently has been quite conservative in adopting this technology.
With a CAGR of almost 25%, the ESD and TVS protection of high power LED will be the fastest growing field of application for IPD protection components in the next five years. RF IPDs are also growing, with a CAGR of ~17% expected in the next 5 years. Next generation RF (such as UWB, ZigBee, LTE, etc…) is the highest growth sub-sector, as RF IPD technology offers the best value proposition in terms of matching accuracy performance, miniaturization, flexible chip to package configuration and fastest time to market solution. Digital and Mixed Signal IPD is still a very small market space. This application has the potential to take-off once IPDs reach the density and electrical performance requirements of DC-DC converter modules and high performance 2.5D silicon digital interposer substrates. Ramp-up is likely to take-off in the 2013-2015 time frame for both applications.
Still, important commercialization opportunities exist for 'custom designed' IPDs in niche and specialty markets, such as medical pace-makers, camera-pills, smart-meters and high reliability applications such as automotive, power electronic, aerospace and defense applications.
TOP 3 PLAYERS HOLD ALMOST 60% OF THE MARKET: NXP, STMicroelectronics & ON SEMICONDUCTOR
Europe is still by far the largest geographical area for the production of thin-film IPDs with the support of STMicroelectronics (FR), NXP (NL), IPDiA (FR) and Infineon (DE).
Following is North America with an important number of power, analog and mixed signal semiconductor companies such as Texas Instruments (US), Semtech (US), MicroSemi (US), Littlefuse (US), Protek (US) and ON Semiconductor (US), which acquired two IPD companies recently: CMD (US) in 2009 for $108M and SDT (US) in 2010. On Semiconductor is now the third largest IPD company worldwide and is in the position to challenge well established European players STMicroelectronics (FR) and NXP (NL).
Japan may keep lagging because of the presence of the largest discrete IPD makers locally (Murata, Panasonic, Epcos-TDK, Kyocera, Taiyo-Yuden…) which are not yet aggressively pushing this technology in the market.
More and more packaging, assembly and test companies (also called 'OSATs'), STATS ChipPAC (SG), Amkor (KR) and SPIL (TW) have entered the IPD market through very different business models. Taiwan related activity is set to increase significantly in the next few years with the entrance of ASE (TW) and TSMC (TW) into this business
MANY KEY TECHNOLOGIES IN THE STARTING BLOCKS OF THIS INDUTRY'S ROADMAP
In terms of component structures and materials, different evolutions are expected in the thin-film IPD technology roadmap. New inductor technologies will enable ever higher integration densities and Q-factor. New capacitor technologies such as 3D trenches will break out the 500nF/mm2 density challenges and enable new applications un-targetable before. New material depositions and techniques will be applied to get along with ferroelectric IPDs and meet with new ROHS regulations. New approaches, such as Paratek (US) acquired by RIM (CA), will be developed to build antenna tuner components for multi-band and multi-mode wireless products.
The importance of packaging has a strong impact on IPD technology. Several different evolutions are expected beyond the used of standard assembly techniques, including the emergence of TSV 'Through-Silicon-Vias' and TGV 'Through-Glass-Vias' interconnects, as well as Embedded chip in PCB and FOWLP type of packages
In terms of manufacturing infrastructure, a slow transition is happening: if the initial commercialization of IPD technology was supported by 150mm wafer fabs, 200mm is today the main infrastructure supporting recent IPD technology commercialization. Many 8'' factories are now in operations, such as STMicroelectronics (FR) in Tours, NXP (NL) in Hamburg Germany, ON Semiconductor (US) in Arizona, STATS ChiPAC (SG) in Woodland, and in Taiwan ASE and TSMC. It is becoming clear that at some point, a larger infrastructure on 300mm will be needed to support the commercialization of this technology, as cost pressure and volume adoption increases and IPDs are penetrating further the wireless consumer market.
KEY FEATURES OF THE REPORT
• 4 applications fields investigated (ESD/EMI protection, HB-LED ESD / TVS protection, RF and Digital & Mixed signal IPD)• Market trends and figures provided both in $M, Munits and wafer size equivalent• Technology roadmap and complete technologies and material tool-box analysis• 30 detailed company profiles of key thin-film IPD players (320+ slides PPT)
This new study exhaustively lists the existing and upcoming technologies and applications for IPDs. The report describes the thin-film IPD market, growth opportunities and the associated technologies deep inside each application.
Each market sub-segment is exhaustively detailed with:• Drivers and benefits of IPDs• Sub-segment size and expected growth rate• Value chain analysis• Global market evaluation per application: volume in units, wafers, and market size ($).• Evaluation of the major market players (market share)• Key thin-film IPD product detailed teardown analysis
COMPANIES CITED IN THIS REPORT
Aiconn, AMD, Amkor, Analog Devices, Apple, apm, ASE, Avago, AVX, AzureWave, Broadcom, Bourns, Bridgelux, CMD, Cree, CSR / Samsung, Energy Micro, Epcos – TDK, Kyocera, Fairchild Semi, Flip-Chip International, Fraunhofer-IZM institute, Freescale, Fujikura, Fujitsu, Gemtek, Icera / nVidia, Ibiden, IBM, IMEC, Infineon, IPDiA, Ibiden, IME, IMEC, Intel, ITRI, Qualcomm - Atheros, Leti, Littlefuse, LG Innotek, Lumileds, Maxim IC, Microsemi, Murata / SyChip, Nichia, NEPES, Nokia, Nordic Semiconductor, NXP, OnChip Devices, ON Semiconductor, Panasonic, Panjit Semiconductor, Paratek, ProTek Devices, Renesas, RFMD, RIM, Samsung, Sequans Communications, Shinko, Silex Microsystems, SiGe Semiconductor, Skyworks, Semtech, StatsChipPAC, STEricsson, STMicroelectronics, Sony, SPIL, Transfer Jet, Telephus / SEMCO, Taiyo Yuden, Texas Instruments, Touch Microsystems Technology, TSMC, Toshiba, Triquint, Tyndall, USI, Viking Tech, Vishay, Wavenics, Wi2wi, Wispry, Zarlink and more…Objectives of the Study p 5
Introduction, Definitions & Scope of the Report p 11
• Overview of discrete versus integrated passive solutions
• Integrated active and passive structure definitions (inductor, capacitor, resistors, diodes, combinations…)
• Comparison between thin-film / thick film IPD technologies (including ceramic LTCC)
• Executive summary
Thin-Film IPD Applications and Market Drivers p 40• ESD/EMI protection• LED Lighting protections• RF IPD• Digital & Mixed Signal IPD• For each category, you will find the analysis of- IPD current and future applications- IPD benefits and market driver descriptions for each IPD function and application- IPD functionalities by category
Thin-Film IPD Market Status & 2011-2017 Forecasts p 142
• IPD market forecasts are provided both in $M, Munits and in wafer eq. with attached CAGR p 143
- Volume shipments for IPD by application (cell-phone, mp3 players, medical, automotive…)
- IPD shipments by category (ESD/EMI protection, LED silicon submount, RF IPDs, Digital & Mixed signal IPDs)
- Specific applicative breakdown and forecast evolution for each category
- IPD shipments by substrate type (Silicon, Glass,…) and wafer size (6" / 8" / 12")
- IPD shipments by integration choice (discrete, Above IC, SiP package…)
- IPD shipments by packaging platform (WLP, Wire bond, Flip-chip, Embedded, Silicon submount, 3D TSV interposer, Fan-Out plastic laminate…)
Thin-Film IPD Supply Chain & Players p 175• Geographical mapping of different players p 176• IPD player market shares and revenues p 177- "Top 10" IPD players' 2008 revenues- Market share breakdown for ESD/EMI protection and RF IPD applications• Business model analysis for IPD• Summary of IPD player capabilities
Thin -Film IPD Technologies p198
• Overall IPD Technology roadmap p199
• IPD technology requirements & options p 204
- Performance and integration capabilities
- Inductors (multilayer planar inductors, 3D inductors…)
- Capacitors (planar versus trench geometries, SiO2 versus SiN versus BST versus PZT capacitors…)
• IPD Manufacturing challenges and related equipment & material tool-box p 225
- Substrate choice technology comparisons:
- Dielectric layer options (low k / high k)
- Trend for ferroelectric IPDs
- Available photoresists, oxide and other layer solutions, impact of layer thickness
- Metallic layer formation (Al, Copper, Gold…)
- Process options (line width, multiple layer IPDs, lithographic versus non lithographic patterning, advanced depositions…)
• IPD Design, Simulation and predictability through system level co-design p 244
Thin-Film IPD Architecture, Assembly & Packaging p 249• Integration, packaging and assembly platforms options for IPDs• Through-Silicon-Via manufacturing: a necessary step to reach the 3rd dimension• Fan-Out Wafer level packaging and embedded die technologies
Conclusions & Perspectives p 289
Intl: +1 805-652-2626
The cloud promises new levels of agility and cost-savings for Big Data, data warehousing and analytics. But it’s challenging to understand all the options – from IaaS and PaaS to newer services like HaaS (Hadoop as a Service) and BDaaS (Big Data as a Service). In her session at @BigDataExpo at @ThingsExpo, Hannah Smalltree, a director at Cazena, will provide an educational overview of emerging “as-a-service” options for Big Data in the cloud. This is critical background for IT and data profes...
Feb. 10, 2016 12:45 AM EST Reads: 189
SYS-CON Events announced today that Men & Mice, the leading global provider of DNS, DHCP and IP address management overlay solutions, will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. The Men & Mice Suite overlay solution is already known for its powerful application in heterogeneous operating environments, enabling enterprises to scale without fuss. Building on a solid range of diverse platform support,...
Feb. 10, 2016 12:00 AM EST Reads: 196
Cognitive Computing is becoming the foundation for a new generation of solutions that have the potential to transform business. Unlike traditional approaches to building solutions, a cognitive computing approach allows the data to help determine the way applications are designed. This contrasts with conventional software development that begins with defining logic based on the current way a business operates. In her session at 18th Cloud Expo, Judith S. Hurwitz, President and CEO of Hurwitz & ...
Feb. 9, 2016 10:15 PM EST Reads: 232
With an estimated 50 billion devices connected to the Internet by 2020, several industries will begin to expand their capabilities for retaining end point data at the edge to better utilize the range of data types and sheer volume of M2M data generated by the Internet of Things. In his session at @ThingsExpo, Don DeLoach, CEO and President of Infobright, will discuss the infrastructures businesses will need to implement to handle this explosion of data by providing specific use cases for filte...
Feb. 9, 2016 05:00 PM EST Reads: 163
SYS-CON Events announced today that VAI, a leading ERP software provider, will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. VAI (Vormittag Associates, Inc.) is a leading independent mid-market ERP software developer renowned for its flexible solutions and ability to automate critical business functions for the distribution, manufacturing, specialty retail and service sectors. An IBM Premier Business Part...
Feb. 9, 2016 04:00 PM EST Reads: 599
Fortunately, meaningful and tangible business cases for IoT are plentiful in a broad array of industries and vertical markets. These range from simple warranty cost reduction for capital intensive assets, to minimizing downtime for vital business tools, to creating feedback loops improving product design, to improving and enhancing enterprise customer experiences. All of these business cases, which will be briefly explored in this session, hinge on cost effectively extracting relevant data from ...
Feb. 9, 2016 03:15 PM EST
As enterprises work to take advantage of Big Data technologies, they frequently become distracted by product-level decisions. In most new Big Data builds this approach is completely counter-productive: it presupposes tools that may not be a fit for development teams, forces IT to take on the burden of evaluating and maintaining unfamiliar technology, and represents a major up-front expense. In his session at @BigDataExpo at @ThingsExpo, Andrew Warfield, CTO and Co-Founder of Coho Data, will dis...
Feb. 9, 2016 03:00 PM EST Reads: 175
SYS-CON Events announced today that Pythian, a global IT services company specializing in helping companies adopt disruptive technologies to optimize revenue-generating systems, has been named “Bronze Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2015 at the Javits Center in New York, New York. Founded in 1997, Pythian is a global IT services company that helps companies compete by adopting disruptive technologies such as cloud, Big Data, advanced analytics, and DevO...
Feb. 9, 2016 02:45 PM EST Reads: 206
SYS-CON Events announced today that iDevices®, the preeminent brand in the connected home industry, will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. iDevices, the preeminent brand in the connected home industry, has a growing line of HomeKit-enabled products available at the largest retailers worldwide. Through the “Designed with iDevices” co-development program and its custom-built IoT Cloud Infrastruc...
Feb. 9, 2016 02:45 PM EST
SYS-CON Events announced today that Alert Logic, Inc., the leading provider of Security-as-a-Service solutions for the cloud, will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. Alert Logic, Inc., provides Security-as-a-Service for on-premises, cloud, and hybrid infrastructures, delivering deep security insight and continuous protection for customers at a lower cost than traditional security solutions. Ful...
Feb. 9, 2016 02:15 PM EST Reads: 401
SYS-CON Events announced today that Interoute, owner-operator of one of Europe's largest networks and a global cloud services platform, has been named “Bronze Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2015 at the Javits Center in New York, New York. Interoute is the owner-operator of one of Europe's largest networks and a global cloud services platform which encompasses 12 data centers, 14 virtual data centers and 31 colocation centers, with connections to 195 ad...
Feb. 9, 2016 01:15 PM EST Reads: 377
SYS-CON Events announced today that Commvault, a global leader in enterprise data protection and information management, has been named “Bronze Sponsor” of SYS-CON's 18th International Cloud Expo, which will take place on June 7–9, 2016, at the Javits Center in New York City, NY, and the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. Commvault is a leading provider of data protection and information management...
Feb. 9, 2016 11:30 AM EST Reads: 412
Eighty percent of a data scientist’s time is spent gathering and cleaning up data, and 80% of all data is unstructured and almost never analyzed. Cognitive computing, in combination with Big Data, is changing the equation by creating data reservoirs and using natural language processing to enable analysis of unstructured data sources. This is impacting every aspect of the analytics profession from how data is mined (and by whom) to how it is delivered. This is not some futuristic vision: it's ha...
Feb. 9, 2016 08:45 AM EST Reads: 431
With the Apple Watch making its way onto wrists all over the world, it’s only a matter of time before it becomes a staple in the workplace. In fact, Forrester reported that 68 percent of technology and business decision-makers characterize wearables as a top priority for 2015. Recognizing their business value early on, FinancialForce.com was the first to bring ERP to wearables, helping streamline communication across front and back office functions. In his session at @ThingsExpo, Kevin Roberts...
Feb. 9, 2016 08:00 AM EST Reads: 376
One of the bewildering things about DevOps is integrating the massive toolchain including the dozens of new tools that seem to crop up every year. Part of DevOps is Continuous Delivery and having a complex toolchain can add additional integration and setup to your developer environment. In his session at @DevOpsSummit at 18th Cloud Expo, Miko Matsumura, Chief Marketing Officer of Gradle Inc., will discuss which tools to use in a developer stack, how to provision the toolchain to minimize onboa...
Feb. 9, 2016 07:45 AM EST
Silver Spring Networks, Inc. (NYSE: SSNI) extended its Internet of Things technology platform with performance enhancements to Gen5 – its fifth generation critical infrastructure networking platform. Already delivering nearly 23 million devices on five continents as one of the leading networking providers in the market, Silver Spring announced it is doubling the maximum speed of its Gen5 network to up to 2.4 Mbps, increasing computational performance by 10x, supporting simultaneous mesh communic...
Feb. 8, 2016 05:00 PM EST
SYS-CON Events announced today that Fusion, a leading provider of cloud services, will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. Fusion, a leading provider of integrated cloud solutions to small, medium and large businesses, is the industry's single source for the cloud. Fusion's advanced, proprietary cloud service platform enables the integration of leading edge solutions in the cloud, including clou...
Feb. 6, 2016 03:30 PM EST Reads: 757
Most people haven’t heard the word, “gamification,” even though they probably, and perhaps unwittingly, participate in it every day. Gamification is “the process of adding games or game-like elements to something (as a task) so as to encourage participation.” Further, gamification is about bringing game mechanics – rules, constructs, processes, and methods – into the real world in an effort to engage people. In his session at @ThingsExpo, Robert Endo, owner and engagement manager of Intrepid D...
Feb. 5, 2016 09:00 PM EST Reads: 816
WebRTC has had a real tough three or four years, and so have those working with it. Only a few short years ago, the development world were excited about WebRTC and proclaiming how awesome it was. You might have played with the technology a couple of years ago, only to find the extra infrastructure requirements were painful to implement and poorly documented. This probably left a bitter taste in your mouth, especially when things went wrong.
Feb. 2, 2016 04:30 AM EST Reads: 883
Learn how IoT, cloud, social networks and last but not least, humans, can be integrated into a seamless integration of cooperative organisms both cybernetic and biological. This has been enabled by recent advances in IoT device capabilities, messaging frameworks, presence and collaboration services, where devices can share information and make independent and human assisted decisions based upon social status from other entities. In his session at @ThingsExpo, Michael Heydt, founder of Seamless...
Feb. 1, 2016 05:00 AM EST Reads: 970