Welcome!

IBM Cloud Authors: Elizabeth White, Liz McMillan, John Esposito, Pat Romanski, Ian Khan

News Feed Item

Thin-Film IPDs

NEW YORK, Jan. 21, 2013 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:

Thin-Film IPDs

http://www.reportlinker.com/p01084119/Thin-Film-IPDs.html#utm_source=prn...

A 2X GROWTH IS EXPECTED IN THE NEXT 5 YEARS WITHIN THE ELECTRONICS INDUSTRY

From a commodity technology initially developed to replace bulky discrete passive components, thin-film Integrated Passive Devices (IPDs) are now a growing industry trend driven by RF, High Brightness LEDs, ESD and EMI protection, and Digital and Mixed Signal applications. This new research study on thin-film Integrated Passive and Active Devices estimates the total IPD market to grow from more than $610M this year to over $1.2B by 2017 with a CAGR of 12%.

ESD and EMI protection IPD revenues are stabilizing, primarily due to the recent decline of NOKIA in the mobile space. NOKIA has been the main driving OEM for the integration of IPDs in volume, with many handsets having from 10 to 15 ESD and EMI protection IPDs per system. It remains to be seen which OEMs will take over NOKIA's leadership in the integration of IPDs? If Sony-Ericsson and Motorola have adopted the technology to limited volume, Apple recently started to adopt more and more IPD components into its end-products, while Samsung recently has been quite conservative in adopting this technology.

With a CAGR of almost 25%, the ESD and TVS protection of high power LED will be the fastest growing field of application for IPD protection components in the next five years. RF IPDs are also growing, with a CAGR of ~17% expected in the next 5 years. Next generation RF (such as UWB, ZigBee, LTE, etc…) is the highest growth sub-sector, as RF IPD technology offers the best value proposition in terms of matching accuracy performance, miniaturization, flexible chip to package configuration and fastest time to market solution. Digital and Mixed Signal IPD is still a very small market space. This application has the potential to take-off once IPDs reach the density and electrical performance requirements of DC-DC converter modules and high performance 2.5D silicon digital interposer substrates. Ramp-up is likely to take-off in the 2013-2015 time frame for both applications.

Still, important commercialization opportunities exist for 'custom designed' IPDs in niche and specialty markets, such as medical pace-makers, camera-pills, smart-meters and high reliability applications such as automotive, power electronic, aerospace and defense applications.

TOP 3 PLAYERS HOLD ALMOST 60% OF THE MARKET: NXP, STMicroelectronics & ON SEMICONDUCTOR

Europe is still by far the largest geographical area for the production of thin-film IPDs with the support of STMicroelectronics (FR), NXP (NL), IPDiA (FR) and Infineon (DE).

Following is North America with an important number of power, analog and mixed signal semiconductor companies such as Texas Instruments (US), Semtech (US), MicroSemi (US), Littlefuse (US), Protek (US) and ON Semiconductor (US), which acquired two IPD companies recently: CMD (US) in 2009 for $108M and SDT (US) in 2010. On Semiconductor is now the third largest IPD company worldwide and is in the position to challenge well established European players STMicroelectronics (FR) and NXP (NL).

Japan may keep lagging because of the presence of the largest discrete IPD makers locally (Murata, Panasonic, Epcos-TDK, Kyocera, Taiyo-Yuden…) which are not yet aggressively pushing this technology in the market.

More and more packaging, assembly and test companies (also called 'OSATs'), STATS ChipPAC (SG), Amkor (KR) and SPIL (TW) have entered the IPD market through very different business models. Taiwan related activity is set to increase significantly in the next few years with the entrance of ASE (TW) and TSMC (TW) into this business

MANY KEY TECHNOLOGIES IN THE STARTING BLOCKS OF THIS INDUTRY'S ROADMAP

In terms of component structures and materials, different evolutions are expected in the thin-film IPD technology roadmap. New inductor technologies will enable ever higher integration densities and Q-factor. New capacitor technologies such as 3D trenches will break out the 500nF/mm2 density challenges and enable new applications un-targetable before. New material depositions and techniques will be applied to get along with ferroelectric IPDs and meet with new ROHS regulations. New approaches, such as Paratek (US) acquired by RIM (CA), will be developed to build antenna tuner components for multi-band and multi-mode wireless products.

The importance of packaging has a strong impact on IPD technology. Several different evolutions are expected beyond the used of standard assembly techniques, including the emergence of TSV 'Through-Silicon-Vias' and TGV 'Through-Glass-Vias' interconnects, as well as Embedded chip in PCB and FOWLP type of packages

In terms of manufacturing infrastructure, a slow transition is happening: if the initial commercialization of IPD technology was supported by 150mm wafer fabs, 200mm is today the main infrastructure supporting recent IPD technology commercialization. Many 8'' factories are now in operations, such as STMicroelectronics (FR) in Tours, NXP (NL) in Hamburg Germany, ON Semiconductor (US) in Arizona, STATS ChiPAC (SG) in Woodland, and in Taiwan ASE and TSMC. It is becoming clear that at some point, a larger infrastructure on 300mm will be needed to support the commercialization of this technology, as cost pressure and volume adoption increases and IPDs are penetrating further the wireless consumer market.

KEY FEATURES OF THE REPORT

• 4 applications fields investigated (ESD/EMI protection, HB-LED ESD / TVS protection, RF and Digital & Mixed signal IPD)• Market trends and figures provided both in $M, Munits and wafer size equivalent• Technology roadmap and complete technologies and material tool-box analysis• 30 detailed company profiles of key thin-film IPD players (320+ slides PPT)

This new study exhaustively lists the existing and upcoming technologies and applications for IPDs. The report describes the thin-film IPD market, growth opportunities and the associated technologies deep inside each application.

Each market sub-segment is exhaustively detailed with:• Drivers and benefits of IPDs• Sub-segment size and expected growth rate• Value chain analysis• Global market evaluation per application: volume in units, wafers, and market size ($).• Evaluation of the major market players (market share)• Key thin-film IPD product detailed teardown analysis

COMPANIES CITED IN THIS REPORT

Aiconn, AMD, Amkor, Analog Devices, Apple, apm, ASE, Avago, AVX, AzureWave, Broadcom, Bourns, Bridgelux, CMD, Cree, CSR / Samsung, Energy Micro, Epcos – TDK, Kyocera, Fairchild Semi, Flip-Chip International, Fraunhofer-IZM institute, Freescale, Fujikura, Fujitsu, Gemtek, Icera / nVidia, Ibiden, IBM, IMEC, Infineon, IPDiA, Ibiden, IME, IMEC, Intel, ITRI, Qualcomm - Atheros, Leti, Littlefuse, LG Innotek, Lumileds, Maxim IC, Microsemi, Murata / SyChip, Nichia, NEPES, Nokia, Nordic Semiconductor, NXP, OnChip Devices, ON Semiconductor, Panasonic, Panjit Semiconductor, Paratek, ProTek Devices, Renesas, RFMD, RIM, Samsung, Sequans Communications, Shinko, Silex Microsystems, SiGe Semiconductor, Skyworks, Semtech, StatsChipPAC, STEricsson, STMicroelectronics, Sony, SPIL, Transfer Jet, Telephus / SEMCO, Taiyo Yuden, Texas Instruments, Touch Microsystems Technology, TSMC, Toshiba, Triquint, Tyndall, USI, Viking Tech, Vishay, Wavenics, Wi2wi, Wispry, Zarlink and more…Objectives of the Study p 5

Introduction, Definitions & Scope of the Report p 11

• Overview of discrete versus integrated passive solutions

• Integrated active and passive structure definitions (inductor, capacitor, resistors, diodes, combinations…)

• Comparison between thin-film / thick film IPD technologies (including ceramic LTCC)

• Executive summary

Thin-Film IPD Applications and Market Drivers p 40• ESD/EMI protection• LED Lighting protections• RF IPD• Digital & Mixed Signal IPD• For each category, you will find the analysis of- IPD current and future applications- IPD benefits and market driver descriptions for each IPD function and application- IPD functionalities by category

Thin-Film IPD Market Status & 2011-2017 Forecasts p 142

• IPD market forecasts are provided both in $M, Munits and in wafer eq. with attached CAGR p 143

- Volume shipments for IPD by application (cell-phone, mp3 players, medical, automotive…)

- IPD shipments by category (ESD/EMI protection, LED silicon submount, RF IPDs, Digital & Mixed signal IPDs)

- Specific applicative breakdown and forecast evolution for each category

- IPD shipments by substrate type (Silicon, Glass,…) and wafer size (6" / 8" / 12")

- IPD shipments by integration choice (discrete, Above IC, SiP package…)

- IPD shipments by packaging platform (WLP, Wire bond, Flip-chip, Embedded, Silicon submount, 3D TSV interposer, Fan-Out plastic laminate…)

Thin-Film IPD Supply Chain & Players p 175• Geographical mapping of different players p 176• IPD player market shares and revenues p 177- "Top 10" IPD players' 2008 revenues- Market share breakdown for ESD/EMI protection and RF IPD applications• Business model analysis for IPD• Summary of IPD player capabilities

Thin -Film IPD Technologies p198

• Overall IPD Technology roadmap p199

• IPD technology requirements & options p 204

- Performance and integration capabilities

- Inductors (multilayer planar inductors, 3D inductors…)

- Capacitors (planar versus trench geometries, SiO2 versus SiN versus BST versus PZT capacitors…)

• IPD Manufacturing challenges and related equipment & material tool-box p 225

- Substrate choice technology comparisons:

- Dielectric layer options (low k / high k)

- Trend for ferroelectric IPDs

- Available photoresists, oxide and other layer solutions, impact of layer thickness

- Metallic layer formation (Al, Copper, Gold…)

- Process options (line width, multiple layer IPDs, lithographic versus non lithographic patterning, advanced depositions…)

• IPD Design, Simulation and predictability through system level co-design p 244

Thin-Film IPD Architecture, Assembly & Packaging p 249• Integration, packaging and assembly platforms options for IPDs• Through-Silicon-Via manufacturing: a necessary step to reach the 3rd dimension• Fan-Out Wafer level packaging and embedded die technologies

Conclusions & Perspectives p 289

To order this report:Telephony Industry: Thin-Film IPDs

Nicolas Bombourg

Reportlinker

Email: nicolasbombourg@reportlinker.com

US: (805)652-2626

Intl: +1 805-652-2626

SOURCE Reportlinker

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

@ThingsExpo Stories
SYS-CON Events announced today that Enzu, a leading provider of cloud hosting solutions, will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. Enzu’s mission is to be the leading provider of enterprise cloud solutions worldwide. Enzu enables online businesses to use its IT infrastructure to their competitive advantage. By offering a suite of proven hosting and management services, Enzu wants companies to foc...
SYS-CON Events announced today the How to Create Angular 2 Clients for the Cloud Workshop, being held June 7, 2016, in conjunction with 18th Cloud Expo | @ThingsExpo, at the Javits Center in New York, NY. Angular 2 is a complete re-write of the popular framework AngularJS. Programming in Angular 2 is greatly simplified. Now it’s a component-based well-performing framework. The immersive one-day workshop led by Yakov Fain, a Java Champion and a co-founder of the IT consultancy Farata Systems and...
IoT generates lots of temporal data. But how do you unlock its value? How do you coordinate the diverse moving parts that must come together when developing your IoT product? What are the key challenges addressed by Data as a Service? How does cloud computing underlie and connect the notions of Digital and DevOps What is the impact of the API economy? What is the business imperative for Cognitive Computing? Get all these questions and hundreds more like them answered at the 18th Cloud Expo...
Customer experience has become a competitive differentiator for companies, and it’s imperative that brands seamlessly connect the customer journey across all platforms. With the continued explosion of IoT, join us for a look at how to build a winning digital foundation in the connected era – today and in the future. In his session at @ThingsExpo, Chris Nguyen, Group Product Marketing Manager at Adobe, will discuss how to successfully leverage mobile, rapidly deploy content, capture real-time d...
In his session at 18th Cloud Expo, Bruce Swann, Senior Product Marketing Manager at Adobe, will discuss how the Adobe Marketing Cloud can help marketers embrace opportunities for personalized, relevant and real-time customer engagement across offline (direct mail, point of sale, call center) and digital (email, website, SMS, mobile apps, social networks, connected objects). Bruce Swann has more than 15 years of experience working with digital marketing disciplines like web analytics, social med...
In his keynote at 18th Cloud Expo, Andrew Keys, Co-Founder of ConsenSys Enterprise, will provide an overview of the evolution of the Internet and the Database and the future of their combination – the Blockchain. Andrew Keys is Co-Founder of ConsenSys Enterprise. He comes to ConsenSys Enterprise with capital markets, technology and entrepreneurial experience. Previously, he worked for UBS investment bank in equities analysis. Later, he was responsible for the creation and distribution of life ...
What a difference a year makes. Organizations aren’t just talking about IoT possibilities, it is now baked into their core business strategy. With IoT, billions of devices generating data from different companies on different networks around the globe need to interact. From efficiency to better customer insights to completely new business models, IoT will turn traditional business models upside down. In the new customer-centric age, the key to success is delivering critical services and apps wit...
The essence of data analysis involves setting up data pipelines that consist of several operations that are chained together – starting from data collection, data quality checks, data integration, data analysis and data visualization (including the setting up of interaction paths in that visualization). In our opinion, the challenges stem from the technology diversity at each stage of the data pipeline as well as the lack of process around the analysis.
SYS-CON Events announced today that ContentMX, the marketing technology and services company with a singular mission to increase engagement and drive more conversations for enterprise, channel and SMB technology marketers, has been named “Sponsor & Exhibitor Lounge Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York City, New York. “CloudExpo is a great opportunity to start a conversation with new prospects, but what happens after the...
SYS-CON Events announced today that 24Notion has been named “Bronze Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York, New York. 24Notion is full-service global creative digital marketing, technology and lifestyle agency that combines strategic ideas with customized tactical execution. With a broad understand of the art of traditional marketing, new media, communications and social influence, 24Notion uniquely understands how to con...
The demand for organizations to expand their infrastructure to multiple IT environments like the cloud, on-premise, mobile, bring your own device (BYOD) and the Internet of Things (IoT) continues to grow. As this hybrid infrastructure increases, the challenge to monitor the security of these systems increases in volume and complexity. In his session at 18th Cloud Expo, Stephen Coty, Chief Security Evangelist at Alert Logic, will show how properly configured and managed security architecture can...
When it comes to IoT in the enterprise, namely the commercial building and hospitality markets, a benefit not getting the attention it deserves is energy efficiency, and IoT's direct impact on a cleaner, greener environment when installed in smart buildings. Until now clean technology was offered piecemeal and led with point solutions that require significant systems integration to orchestrate and deploy. There didn't exist a 'top down' approach that can manage and monitor the way a Smart Buildi...
SYS-CON Events announced today BZ Media LLC has been named “Media Sponsor” of SYS-CON's 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. BZ Media LLC is a high-tech media company that produces technical conferences and expositions, and publishes a magazine, newsletters and websites in the software development, SharePoint, mobile development and Commercial Drone markets.
WebRTC is bringing significant change to the communications landscape that will bridge the worlds of web and telephony, making the Internet the new standard for communications. Cloud9 took the road less traveled and used WebRTC to create a downloadable enterprise-grade communications platform that is changing the communication dynamic in the financial sector. In his session at @ThingsExpo, Leo Papadopoulos, CTO of Cloud9, will discuss the importance of WebRTC and how it enables companies to fo...
SYS-CON Events announced today TechTarget has been named “Media Sponsor” of SYS-CON's 18th International Cloud Expo, which will take place on June 7–9, 2016, at the Javits Center in New York City, NY, and the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. TechTarget is the Web’s leading destination for serious technology buyers researching and making enterprise technology decisions. Its extensive global networ...
With major technology companies and startups seriously embracing IoT strategies, now is the perfect time to attend @ThingsExpo 2016 in New York and Silicon Valley. Learn what is going on, contribute to the discussions, and ensure that your enterprise is as "IoT-Ready" as it can be! Internet of @ThingsExpo, taking place Nov 3-5, 2015, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with 17th Cloud Expo and will feature technical sessions from a rock star conference faculty ...
The 19th International Cloud Expo has announced that its Call for Papers is open. Cloud Expo, to be held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA, brings together Cloud Computing, Big Data, Internet of Things, DevOps, Containers, Microservices and WebRTC to one location. With cloud computing driving a higher percentage of enterprise IT budgets every year, it becomes increasingly important to plant your flag in this fast-expanding business opportunity. Submit y...
Internet of @ThingsExpo, taking place November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with the 19th International Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world and ThingsExpo New York Call for Papers is now open.
There are several IoTs: the Industrial Internet, Consumer Wearables, Wearables and Healthcare, Supply Chains, and the movement toward Smart Grids, Cities, Regions, and Nations. There are competing communications standards every step of the way, a bewildering array of sensors and devices, and an entire world of competing data analytics platforms. To some this appears to be chaos. In this power panel at @ThingsExpo, moderated by Conference Chair Roger Strukhoff, panelists will discuss the vast to...
A strange thing is happening along the way to the Internet of Things, namely far too many devices to work with and manage. It has become clear that we'll need much higher efficiency user experiences that can allow us to more easily and scalably work with the thousands of devices that will soon be in each of our lives. Enter the conversational interface revolution, combining bots we can literally talk with, gesture to, and even direct with our thoughts, with embedded artificial intelligence, wh...