|By PR Newswire||
|January 23, 2013 07:01 AM EST||
NEW YORK, Jan. 23, 2013 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:
THIS WAFER PACKAGING FABS DATABASE FEATURES 275 FACTORIES WITH CAPACITIES FOR EACH ADVANCED PACKAGING PLATFORM
This second edition of the Wafer Packaging Fab database provides an exhaustive list of players involved in the Middle-End area. This unique tool provides a global overview of "who is doing what" in this emerging ecosystem. Many details concerning each fab location are provided (fab functions, customers, JV, capacities by wafer size etc.). In addition, we propose in this new version the analysis of installed capacities in the Middle-End area through 100+ charts, following 3 main angles:
• Advanced packaging platforms
• Geographical locations
All the charts are provided in the database excel file and in a 100 slide Powerpoint document.
For the first time, new analysis and charts about capacities expansions have been integrated in the database, thus giving an overview of investments on the 2010 – 2014 time frame.
MORE THAN 150 ENTRIES BY COMPANY !
Our database references 275 fab locations with technical information related to Wafer Level Packaging technologies or "Middle-End" capabilities
The tool provides an exhaustive list of players (IDM, OSAT, packaging house, bumping house, etc…):
Search by technology capacities and capabilities
Study the profile and repartition of one given technology among the different industry players
Study players manufacturing strategy, supply chain and worldwide strategy
Find small and big volume sources for your products
• General information:
- 275 fabs
- Fab location
- Fab function (Front-end, Back-end, etc…)
- Main Customer, JV, partnership
- Business model
• Technology platforms available by location:
- 3D WLCSP
- 2.5D Interposers
- Wafer Level Optics
- Bumping (Au, solder, Cu, etc…)
• Capacities information by wafer size
- Capacities by platforms
- Capacities by bumping technologies
• 2010/2014 Capacities expansion plans
- Capacities expansion by advanced packaging platform
• 100+ key charts provided in a PDF presentation
- Breakdown by business model
- Breakdown by regions/country
- Breakdown by player
- Breakdown by wafer size
- 2010 – 2014 middle-end capacity expansion
- 2010 – 2014 capacity expansion by player
- Top 30 biggest capacities in the middle-end
WHO SHOULD BUY THIS DATABASE ?
• Equipment & Material suppliers
- Identify key players and key locations
- Worldwide mapping of players
- Identify key players and key locations with installed capacities in the Middle-End Area
- Identify technology capabilities and capacities by players, regions, or business model
• Fabless and fablight players
- Oversee subcontractors capabilities and capacities
- Identify key source
- Understand technology trends and benchmark several different subcontractors
• Small IDM or niche market IDM
- Identify prototype lines
- Identify fab capable of handling specific wafers (exotic materials, small diameter, …)
• IDM and foundry
- Worldwide mapping of players
- Identify competitors or customers capabilities and capacities
• OSAT, packaging house, bumping house
- Get an exhaustive list of competitors or partners
- Evaluate global capacities by technologies, regions, business model
- Information about key customers
MAJOR COMPANIES CITED IN THE DATABASE
Amkor, Analog Devices, ASE, ASTRI, Avago, Bosch, CEA-LETI, China WLCSP, ChipBond, ChipMOS, EPCOS-TDK, Epson Electronics, Fairchild, Flip Chip International, Flip Chip Millennium, Fraunhofer, Freescale, Fujikura, Fujitsu Integrated Microtechnology, Global Foundries, IBM, IMEC, Infineon, INTEL, ITRI, JCET, Maxim IC, NANIUM, NEPES, NXP, OptoPAC, PTI, Renesas, Rohm, Samsung, SMIC, SK Hynix, Sony, SPIL, STATS ChipPAC, STMicroelectronics, Teramikros, Texas Instrument, Tezzaron, Toshiba, TriQuint, TSMC, UMC Global, Xintec.
To order this report:
Intl: +1 805-652-2626
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