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Global Next Generation Memory Market (2012 -2017), By Technology (DRAM, SRAM, Flash Memory, Memristor, Magneto Resistive RAM (MRAM), Phase Change RAM (PCRAM), Ferroelectric RAM), Application & Geography

DUBLIN, April 26, 2013 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/vssc2w/global_next) has announced the addition of the "Global Next Generation Memory Market (2012 -2017), By Technology (DRAM, SRAM, Flash Memory, Memristor, Magneto Resistive RAM (MRAM), Phase Change RAM (PCRAM), Ferroelectric RAM), Application & Geography" report to their offering.

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Next generation memories are the emerging non-volatile memory technologies, which are expected to replace existing memories. Not all existing memories will be replaced though. Next generation memories majorly targets the non-volatile memories such as NAND and NOR. High write and read latency, scalability, high endurance etc. makes emerging memories the best replacement for traditional non-volatile memories. Next generation memory technologies covered in this report are MRAM, PCRAM, FeRAM and memristor also called as ReRAM. Out of these memories, only MRAM and FeRAM have reasonable market share and they are quite commercialized in the market. PCRAM has very marginal market and memristor is set to enter the market by the end of 2013.

The major drivers for the next generation memory market are faster switching time, high endurance and power efficient. In addition, the huge application base of traditional memories will also become the driver for this market. Since these memories are not completely established, there are still flaws in processes which cause drawbacks like instability and low write endurance rate in some of the memories. As mentioned, these memories are the replacement for flash memories in near future. The flash market has already tapped the huge market, hence it makes the way for next generation memories.

The major issue for next generation memories is its design cost. Not all the processes are intact yet, which increases the cost of the process and design. However, early adoption of these memories will be the game changing strategy for memory market. Most of the next generation memories are also called 'universal memory', which performs both the volatile and non-volatile function. So, the early adoption of such memories will be crucial for the companies.

 

The companies currently involved in next generation memory market are:

- Adesto
- Cypress Semiconductor Corporation.
- Crocus Technology
- Everspin Technologies, Inc.
- Fujitsu
- Gsi Technology
- Hewlett-Packard Development Company, L.P.
- IBM
- Integrated Device Technology, Inc.
- Integrated Silicon Solutions, Inc.
- Intel Corporation
- Micron Technology, Inc.
- Nanya Technology Corporation
- Nve Corporation
- Ovonyx, Inc.
- Promos Technologies Inc.
- Powerchip Technology Corporation
- Rambus Inc.
- Ramtron International Corporation
- Samsung
- Sk Hynix Inc.
- Sony Corporation
- Stmicroelectronics
- Texas Instruments Incorporated
- Toshiba Corporation
- Winbond Electronics Corp.

 

Scope of the report

This research report categorizes the global next generation memory market; based on type, applications, and geography; it also covers the forecasted revenue and future applications of global next generation memory market.

On the basis of type

Global next generation memory market is mainly categorized into traditional memories and next generation memories. Traditional memories covered in this report are DRAM, SRAM and flash (NAND and NOR). Next generation or emerging non-volatile memories covered in this report are MRAM, FeRAM, PCRAM and memristor (ReRAM).

On the basis of application areas

Global next generation memory applications market is categorized into computers and storage electronics, ICT, consumer electronics, automotive electronics, industrial applications and aerospace and defence.

On the basis of geography

Geographical analysis covers North America, Europe, Asia-Pacific, and ROW. Europe covers the major countries like Germany, Italy, U.K., France, etc. Asia-Pacific (APAC) covers China, Japan, Taiwan, India, Australia, etc. ROW covers Middle East and Africa.

 

Key Topics Covered:

1 Introduction
2 Executive Summary
3 Market Overview
4 Next Generation Memory Market, By Technology
5 Next Generation Memory Market, By Application
6 Next Generation Memory Market, By Geography
7 Competitive Landscape
8 Company Profiles

Tables and Figures Included

 

For more information visit http://www.researchandmarkets.com/research/vssc2w/global_next

Research and Markets

Laura Wood, Senior Manager.
press@researchandmarkets.com
U.S. Fax: +1-646-607-1907
Fax (outside U.S.): +353-1-481-1716

Sector: Computing and Technology, Semiconductor

SOURCE Research and Markets

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